LMR16020PDDAR

{
 "schema": "adom.pads/1",
 "slug": "lmr16020pddar",
 "footprint": "TI_SO-PowerPAD-8",
 "generated_from": {
  "footprint": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.78,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 0,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "BOOT",
   "type": "passive",
   "description": "Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1 µF capacitor from BOOT to SW. Absolute max BOOT-to-GND = 71 V; BOOT-to-SW = 6.5 V.",
   "is_pin1": true,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "VIN",
   "type": "power_in",
   "description": "Power supply input, 4.3 V to 60 V operating (65 V absolute max). Connect bypass capacitor CIN between VIN and GND with minimum trace length.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "EN",
   "type": "input",
   "description": "Enable pin with internal pull-up current source. Pull below 1.2 V (typ threshold 1.20 V) to disable; float or tie to VIN to enable. Can be driven by a resistor divider from VIN to program the input under-voltage lockout.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "RT/SYNC",
   "type": "bidirectional",
   "description": "Resistor Timing or External Clock input. A resistor from RT/SYNC to GND sets the switching frequency (200 kHz-2.5 MHz). Driving the pin above the PLL threshold switches it to a synchronization input (250 kHz-2.3 MHz); if clocks stop, it reverts to resistor-programmed mode.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "FB",
   "type": "input",
   "description": "Feedback input pin. Connect to the resistor divider from VOUT to set the output voltage; internal reference VFB = 0.750 V (typ). Do not short this pin to GND during operation.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "PGOOD",
   "type": "output",
   "description": "Power-Good open-drain output flag. Use a 10 kΩ to 100 kΩ pull-up resistor to a logic rail or DC voltage no higher than 7 V. Asserts when FB is within roughly 94%-107% of the reference.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "GND",
   "type": "power_in",
   "description": "System ground pin. Return for VIN bypass and internal control circuitry.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "SW",
   "type": "power_out",
   "description": "Switching output of the regulator, internally connected to the high-side power MOSFET (155 mΩ RDS(on)). Connect to the power inductor and to the catch diode's cathode. SW-to-GND rating: -3 V to 65 V absolute max.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -0.6025,
    -0.775
   ],
   "rot": 0.0,
   "size": [
    1.205,
    1.55
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "9",
   "name": "Thermal Pad",
   "type": "power_in",
   "description": "Exposed thermal pad on package underside; primary heat dissipation path from the die. Must be soldered to the PCB ground plane for proper thermal performance and electrical ground reference.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}