component

LMR14030SQDPRRQ1

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, WSON-10-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LMR14030SQDPRRQ1

Texas Instruments · DC-DC Converters · WSON-10-EP(4x4)

LMR14030SQDPRRQ1 from Texas Instruments, in a WSON-10-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT power_in Bootstrap capacitor connection for high-side MOSFET driver; connect 0.1μF capacitor between BOOT and SW pins.
2 VIN power_in Power supply input, 4V to 40V; connect to high-frequency bypass capacitor CIN with shortest possible PCB trace from VIN pin to GND.
3 VIN power_in Power supply input, 4V to 40V; second VIN pin requiring high-frequency bypass capacitor CIN connection.
4 EN input Enable input with internal pull-up current source; device disabled when EN < 1.2V, enabled when EN > 1.2V (typical), floating or connected to VIN enables device.
5 RT/SYNC input Resistor timing or external clock input (250kHz to 2.3MHz); maintains fixed voltage when using external ground resistor for frequency programming or presents high-impedance clock input when synchronizing to external clock.
6 SS input Soft-start control input; connect capacitor to set soft-start time from 0V to VREF, maximum 4.7nF for WSON package.
7 FB input Feedback input for output voltage regulation; connect to output voltage divider to set VOUT, do not short to ground during device operation.
8 PGOOD output Power good open-drain output; pulls low when output voltage deviates beyond ±8% (typical) from nominal, requires 10kΩ to 100kΩ pull-up resistor to voltage not exceeding 7V.
9 GND power_in System ground reference pin; primary connection point for all ground signals.
10 SW output Switching output node internally connected to low-side power MOSFET; connect to output inductor L for buck converter operation.
11 Thermal Pad power_in Primary thermal dissipation path for die; must be connected to PCB ground plane via thermal vias for proper heat transfer.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-10-EP(4x4)
Category Power Supply Chip
Pins 11

CAD (KiCad official)

  • Symbol: LMR14030SQDPRRQ1
  • Footprint: Package_SON:WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm
  • 3D model: WSON-10-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: lmr14030sqdprrq1-etched.step / lmr14030sqdprrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmr14030sqdprrq1.step / lmr14030sqdprrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (37 pp, sha256 1f91b09fa6ebdebe, retrieved 2026-10-03, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF