component

LMR14030QDPRRQ1

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, WSON-10-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LMR14030QDPRRQ1

Texas Instruments · DC-DC Converters · WSON-10-EP(4x4)

LMR14030QDPRRQ1 from Texas Instruments, in a WSON-10-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT power_in Bootstrap capacitor connection point for high-side MOSFET gate driver; connect high-quality 0.1μF capacitor between BOOT and SW pins.
2 VIN power_in Power supply input, operating voltage range 4V to 40V; connection to supply and bypass capacitor with shortest possible path to ground.
3 VIN power_in Power supply input, operating voltage range 4V to 40V; dual connection point to minimize supply path inductance.
4 EN input Enable control input with internal 1μA pull-up current source; pull below 1.2V threshold to disable device, above 1.2V to enable; under-voltage lockout can be adjusted with external resistor divider.
5 RT/SYNC input Frequency programming resistor to ground or external clock input; programs switching frequency 200kHz to 2.5MHz with resistor, or 250kHz to 2.3MHz with external clock; clock levels high ≥1.7V, low ≤0.5V, minimum pulse width ≥30ns.
6 SS input Soft-start capacitor connection point; charges at 3μA internal current to program soft-start time; maximum capacitor value 4.7nF for WSON package.
7 FB input Feedback voltage input from output divider to set VOUT; internal reference voltage 0.75V; do not allow short to ground during operation.
8 PGOOD tri_state Open-drain power good output flag indicating output voltage within regulation range (94-109% of VREF tolerance); requires 10kΩ to 100kΩ external pull-up resistor; maximum pin voltage 7V.
9 GND power_in System ground reference and return path for all circuits.
10 SW output Switching output node connected to internal low-side MOSFET and output power inductor; output voltage swings between ground and approximately VIN.
11 Thermal Pad power_in Primary thermal dissipation path for the die; must be connected to PCB ground plane to minimize junction-to-board thermal impedance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-10-EP(4x4)
Category Power Management (PMIC)
Pins 11

CAD (KiCad official)

  • Symbol: LMR14030QDPRRQ1
  • Footprint: Package_SON:WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm
  • 3D model: WSON-10-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: lmr14030qdprrq1-etched.step / lmr14030qdprrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmr14030qdprrq1.step / lmr14030qdprrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (37 pp, sha256 1f91b09fa6ebdebe, retrieved 2026-10-03, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF