main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 5d ago
viewers lmr12010xmk: viewers · Ray 5d ago
lmr12010xmk-etched.glb Publish 0.1.0 · Ray 5d ago
lmr12010xmk-etched.step lmr12010xmk: factory component page (tier=mfr) · Ray 5d ago
lmr12010xmk-hero.glb lmr12010xmk: hero GLB from the etched model (keeps the MPN mark) · Ray 5d ago
lmr12010xmk-hero.overlay.json Publish 0.1.0 · Ray 5d ago
lmr12010xmk.glb Publish 0.1.0 · Ray 5d ago
lmr12010xmk.kicad_mod Publish 0.1.0 · Ray 5d ago
lmr12010xmk.kicad_sym Publish 0.1.0 · Ray 5d ago
lmr12010xmk.lbr Publish 0.1.0 · Ray 5d ago
lmr12010xmk.step Publish 0.1.0 · Ray 5d ago
package.json Publish 0.1.0 · Ray 5d ago
page.json Set visibility: public · Ray 5d ago
README.md Publish 0.1.0 · Ray 5d ago
verification.json Verified: Published by the parts factory: tier mfr, 6 pins · Ray 5d ago

LMR12010XMK

Texas Instruments · DC-DC Converters · SOT-23-6

LMR12010XMK from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOST power_in Boost voltage that drives the internal NMOS control switch, with a bootstrap capacitor connected between the BOOST and SW pins.
2 GND power_in Signal and power ground; the bottom resistor of the feedback network must be placed as close as possible to this pin for accurate regulation.
3 FB input Feedback pin, connected to the external resistor divider to set the output voltage.
4 EN input Enable control input where logic high enables operation; do not allow this pin to float or be greater than VIN + 0.3V.
5 VIN power_in Input supply voltage, with a bypass capacitor connected to this pin.
6 SW output Output switch that connects to the inductor, catch diode, and bootstrap capacitor.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback Voltage VFB 0.784 0.8 0.816 V 5
Feedback Input Bias Current IFB 10 250 nA Sink/Source 5
Undervoltage Lockout VIN Rising UVLO 2.74 2.9 V VIN Rising 5
Undervoltage Lockout VIN Falling UVLO 2 2.3 V VIN Falling 5
Switching Frequency LMR12010X FSW 1.2 1.6 1.9 MHz LMR12010X 5
Maximum Duty Cycle LMR12010X DMAX 85 92 % LMR12010X 5
Minimum Duty Cycle LMR12010X DMIN 2 % LMR12010X 5
Switch ON Resistance RDS(ON) 300 600 mΩ VBOOST - VSW = 3V 5
Switch Current Limit ICL 1.2 1.7 2.5 A VBOOST - VSW = 3V 5
Quiescent Current Switching IQ 1.5 2.5 mA Switching 5
Quiescent Current Shutdown IQ 30 nA VEN = 0V 5
Boost Pin Current LMR12010X IBOOST 2.5 3.5 mA LMR12010X (50% Duty Cycle) 5
Shutdown Threshold Voltage VEN Falling VEN_TH 0.4 V VEN Falling 5
Enable Threshold Voltage VEN Rising VEN_TH 1.8 V VEN Rising 5
Enable Pin Current IEN 10 nA Sink/Source 5
Switch Leakage ISW 40 nA 5
Input Voltage Range VIN 3 20 V 4
SW Voltage SW -0.5 20 V 4
Boost Voltage BOOST -0.5 25 V 4
Boost to SW Voltage BOOST-SW 1.6 5.5 V 4
Junction Temperature Range TJ -40 125 °C 4
Thermal Resistance Junction-to-Ambient θJA 118 °C/W Footnote (2) of Recommended Operating Ratings 4
VIN Absolute Maximum VIN -0.5 24 V 4
SW Voltage Absolute Maximum SW -0.5 24 V 4
Boost Voltage Absolute Maximum BOOST -0.5 30 V 4
Boost to SW Voltage Absolute Maximum BOOST-SW -0.5 6 V 4
FB Voltage Absolute Maximum FB -0.5 3 V 4
Junction Temperature Absolute Maximum TJ 150 °C 4
ESD Susceptibility ESD 2 kV Human body model, 1.5kΩ in series with 100pF 4
Storage Temperature Range TSTG -65 150 °C 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper The datasheet specifies two different RθJA numbers for the 6-pin SOT-23-THIN package. The two numbers show the difference in thermal impedance for a four-layer board with 2-oz. copper traces, vs. a fo 22

CAD (KiCad official)

  • Symbol: LMR12010XMK
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lmr12010xmk-etched.step / lmr12010xmk-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmr12010xmk.step / lmr12010xmk.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (33 pp, sha256 3068c8a516c22576, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF