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Ray Publish 0.1.0 0c98185 5h ago

LMN25HF2P0R002S

prosemi · Current Sense Resistors / Shunt Resistors · 2512

LMN25HF2P0R002S from prosemi, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer prosemi
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance value (code R002) R 2 mΩ Resistance code R002 = 2 mΩ 1
Resistance tolerance (code F) -1 1 % Tolerance code F: ±1.0% 1
Temperature coefficient of resistance (TCR) -50 50 ppm/°C Standard TCR, LMN25H 2W&3W 1
Power rating P 2 W Power at 70°C, power code 2P0 1
Operating temperature range -55 170 °C 1
Resistance range (narrow electrode) 0.002 0.1 Ω Narrow electrode, R002-R100 2
Short time overload resistance change -0.5 0.5 % 5 times rated power for 5 s; measured after 24 h standing 4
Resistance to soldering heat resistance change -0.5 0.5 % 260±5°C, 10±1 s 4
Temperature cycling resistance change -0.5 0.5 % -55°C (30 min)/+125°C (30 min), 1000 cycles 4
Low temperature storage resistance change -0.5 0.5 % -55°C, 1000 h, no power 4
High temperature storage resistance change -1 1 % 125°C, 1000 h, no power 4
Bias humidity resistance change -0.5 0.5 % +85°C, 85% RH, 10% bias, 1000 h 4
Operational life resistance change -1 1 % 70°C ±2°C, 1000 h, rated power 1.5 h ON / 0.5 h OFF 4
Joint strength of solder resistance change -0.5 0.5 % Bending test plate, JIS-C5201 4
Peak reflow temperature TP 260 °C Pb-free reflow; time within 5°C of peak 20-40 s 3
Wave soldering temperature 260 °C 10 s max 3
Hand soldering temperature 350 °C 5 s max 3

CAD (KiCad official)

  • Symbol: LMN25HF2P0R002S
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: lmn25hf2p0r002s-etched.step / lmn25hf2p0r002s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmn25hf2p0r002s.step / lmn25hf2p0r002s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: prosemi datasheet (6 pp, sha256 ec1f6e401e89a413, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF