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Contents

README

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LMH1208RTVT

Texas Instruments · Video Interface ICs · WQFN-32-EP(5x5)

LMH1208RTVT from Texas Instruments, in a WQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDI_OUT1+ output Single-ended complementary output to 75-Ω cable with integrated on-chip 75-Ω termination and return loss compensation network; requires 4.7-µF AC-coupling capacitor.
2 SDI_OUT1- output Single-ended complementary return output to 75-Ω cable with integrated on-chip 75-Ω termination; requires 4.7-µF AC-coupling capacitor and external 75-Ω termination to GND.
3 VSS power_in Ground reference.
4 OUT0_SEL input LVCMOS control pin to enable 100-Ω host-side output driver at OUT0±; internally pulled high by default (OUT0 disabled).
5 RSV6 unconnected Reserved pin; do not connect.
6 VSS power_in Ground reference.
7 SDI_OUT2- output Single-ended complementary return output to 75-Ω cable with integrated on-chip 75-Ω termination; requires 4.7-µF AC-coupling capacitor and external 75-Ω termination to GND.
8 SDI_OUT2+ output Single-ended complementary output to 75-Ω cable with integrated on-chip 75-Ω termination and return loss compensation; requires 4.7-µF AC-coupling capacitor.
9 HOST_EQ0 input 4-level strap pin; selects equalizer setting for IN0± differential input (H/F/R/L correspond to EQ boost levels 0x00/0x00/0x80/0x90).
10 RSV1 unconnected Reserved pin; do not connect.
11 SS_N input SPI slave select (active low) LVCMOS input when MODE_SEL = F; also serves as ADDR0 4-level SMBus address strap when MODE_SEL = L; internally pulled high by default.
12 MODE_SEL input 4-level strap pin; selects SPI interface (F) or SMBus interface (L) for serial control access.
13 MOSI input SPI master output/slave input (2.5-V LVCMOS) when MODE_SEL = F; also serves as SDA SMBus bidirectional data line (open-drain, 3.3-V tolerant) when MODE_SEL = L.
14 SDI_OUT2_SEL input LVCMOS control pin to enable 75-Ω cable driver output at SDI_OUT2±; internally pulled high by default (SDI_OUT2 disabled).
15 RSV2 unconnected Reserved pin; do not connect.
16 RSV3 unconnected Reserved pin; do not connect.
17 SLEW_CTRL input 4-level strap pin; selects output edge rate and pre-emphasis level for cable drivers SDI_OUT1± and SDI_OUT2± based on SMPTE data rate (H/F/R/L for 12G/HD/270M rates).
18 IN0- input Differential input from host video processor to 100-Ω on-chip termination; requires 4.7-µF AC-coupling capacitor.
19 IN0+ input Differential input from host video processor to 100-Ω on-chip termination; requires 4.7-µF AC-coupling capacitor.
20 VSS power_in Ground reference.
21 RSV_L power_in Power supply input; connect to same 2.5-V ± 5% external supply as VIN.
22 OUT0- output Differential output to host video processor from 100-Ω driver with on-chip termination; requires 4.7-µF AC-coupling capacitor.
23 OUT0+ output Differential output to host video processor from 100-Ω driver with on-chip termination; requires 4.7-µF AC-coupling capacitor.
24 SDI_VOD input 4-level strap pin; selects output amplitude for cable drivers SDI_OUT1± and SDI_OUT2± (H/F/R/L correspond to +5%/800mVpp/+10%/-5% of nominal).
25 RSV5 unconnected Reserved pin; do not connect.
26 RSV4 unconnected Reserved pin; do not connect.
27 SD_N output Signal detect indicator; 3.3-V tolerant open-drain output that pulls low when signal is detected at IN0±; requires external resistor to logic supply.
28 MISO output SPI master input/slave output (2.5-V LVCMOS) when MODE_SEL = F; also serves as ADDR1 4-level SMBus address strap when MODE_SEL = L.
29 SCK input SPI serial clock input (2.5-V LVCMOS) when MODE_SEL = F; also serves as SCL SMBus clock line (open-drain, 3.3-V tolerant) when MODE_SEL = L.
30 VIN power_in Main power supply input; connect to external 2.5-V ± 5% supply.
31 VDD_LDO power_out Output of internal 1.8-V LDO regulator for internal circuitry; requires external 1-µF and 0.1-µF bypass capacitors to VSS.
32 ENABLE input LVCMOS control pin; logic high enables normal operation, logic low forces power-down mode; internally pulled high by default.
EP EP power_in Exposed thermal pad at bottom of package; connect to VSS ground plane through 3×3 via array for thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-32-EP(5x5)
Category Interface
Pins 33

CAD (KiCad official)

  • Symbol: LMH1208RTVT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: WQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: lmh1208rtvt-etched.step / lmh1208rtvt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmh1208rtvt.step / lmh1208rtvt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (48 pp, sha256 ec37be72aa001a79, retrieved 2026-09-29, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF