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Contents

README

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LMBZ5245BLT1G

LRC · Zener Diodes · SOT-23

LMBZ5245BLT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode; the pinout is given as 1-Anode, 2-No Connection, 3-Cathode for this series, and LMBZ5245BLT1G is specified at nominal VZ 15 V (14.25 V min to 15.75 V max) at IZT 8.5 mA.
2 NC unconnected No connection; the datasheet pinout lists this pin as No Connection (NC).
3 Cathode passive Cathode of the Zener diode, indicated by the polarity band on the package; the device is rated 225 mW total power dissipation on FR-5 board at TA = 25°C.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 14.25 15 15.75 Volts @ IZT = 8.5 mA; pulse test current at 25°C (Note 3) 3
Maximum Zener Impedance ZZT 16 Ω @ IZT = 8.5 mA 2
Maximum Zener Impedance ZZK 600 Ω @ IZK = 0.25 mA 2
Forward Voltage VF 0.9 V @ IF = 10 mA, all types 3
Total Power Dissipation on FR-5 Board PD 225 mW FR-5 board (Note 1) @ TA = 25°C 1
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate (Note 2) @ TA = 25°C 1
Thermal Resistance Junction-to-Ambient, FR-5 Board RθJA 556 °C/W FR-5 board (Note 1) 1
Thermal Resistance Junction-to-Ambient, Alumina Substrate RθJA 417 °C/W Alumina substrate (Note 2) 1
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 1
Reverse Leakage Current IR 0.1 A @ VR = 11 V 3
Derating above 25°C, FR-5 Board PD 1.8 mW/°C Derated above 25°C, FR-5 board 1
Derating above 25°C, Alumina Substrate PD 2.4 mW/°C Derated above 25°C, alumina substrate 1

CAD (KiCad official)

  • Symbol: LMBZ5245BLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lmbz5245blt1g-etched.step / lmbz5245blt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmbz5245blt1g.step / lmbz5245blt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 2c2e315ad416a912, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF