component

LMBZ5226BLT1G

Public Made by Adom

by adom

LRC Zener Diodes, SOT-23(TO-236AB). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LMBZ5226BLT1G

LRC · Zener Diodes · SOT-23(TO-236AB)

LMBZ5226BLT1G from LRC, in a SOT-23(TO-236AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode; forward voltage VF is 0.95 V max at IF = 10 mA (page 2 header; page 3 gives 0.9 V max).
2 NC unconnected No connection.
3 Cathode passive Cathode of the Zener diode, indicated by the polarity band; LMBZ5226BLT1G has VZ of 3.13 V min, 3.3 V nom and 3.47 V max at IZT = 20 mA.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23(TO-236AB)
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 3.13 3.3 3.47 V @ IZT = 20 mA, TA = 25°C 3
Zener Test Current IZT 20 mA 3
Maximum Zener Impedance ZZT 28 Ω @ IZT = 20 mA 3
Maximum Zener Impedance ZZK 1600 Ω @ IZK = 0.25 mA 3
Reverse Leakage Current IR 25 µA @ VR = 1 V 3
Forward Voltage VF 0.9 V @ IF = 10 mA, all types 3
Total Power Dissipation on FR-5 Board PD 225 mW @ TA = 25°C, FR-5 board; derate 1.8 mW/°C above 25°C 1
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C, alumina substrate; derate 2.4 mW/°C above 25°C 1
Thermal Resistance Junction-to-Ambient (FR-5) RJA 556 °C/W FR-5 board 1
Thermal Resistance Junction-to-Ambient (Alumina) RJA 417 °C/W Alumina substrate 1
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 1
Maximum Case Temperature for Soldering 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: LMBZ5226BLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236AB) (KiCad packages3D, STEP)
  • 3D model files: lmbz5226blt1g-etched.step / lmbz5226blt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmbz5226blt1g.step / lmbz5226blt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 2c2e315ad416a912, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF