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Contents

README

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LM7812S2

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-263-2

LM7812S2 from HGSEMI, in a TO-263-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Vcc power_in Unregulated input supply to the regulator; for the LM7812 the datasheet gives an input range of 14.5 V to 35 V and an absolute maximum input voltage of 35 V.
2 GND power_in Ground reference pin for the regulator, shared between input and output return.
3 OUT power_out Regulated 12 V output (Vo 11.5 V to 12.5 V at Io = 0.5 A) with a maximum output current IOM of 1.2 A.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package TO-263-2
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage Vo 11.5 12 12.5 V VI=19V,Io=0.5A,PD≤15W 5
Line regulation REGv 3 120 mV VI=16~22V 5
Load regulation REGL 12 240 mV Io=5mA~1.2A 5
Input voltage VI 14.5 35 V 5
Input voltage (absolute maximum) VIN 35 V 3
Power dissipation PD 15 W 3
Operating ambient temperature Tamb 0 125 ℃ 3
Storage temperature Tstg -55 150 ℃ 3
Lead temperature (soldering 10s) TLEAD 245 ℃ 3
Ripple rejection Srip 55 dB VI=15~25V,Io=100mA,f=120Hz 5
Maximum output current IOM 1.2 A 5
Output voltage temperature coefficient ∆V/T -0.8 mV/℃ Io=5mA,Tj=0~125℃ 5
Output noise voltage VNO 75 µV f=10Hz~100kHz 5
Junction-to-ambient thermal resistance (TO-263 column) RθJA 44.8 °C/W 3
Junction-to-case (top) thermal resistance (TO-263 column) RθJC(top) 45.6 °C/W 3
Junction-to-board thermal resistance (TO-263 column) RθJB 24.4 °C/W 3
Junction-to-case (bottom) thermal resistance (TO-263 column) RθJC(bot) 1.5 °C/W 3
Junction-to-top characterization parameter (TO-263 column) ΨJT 11.2 °C/W 3
Junction-to-board characterization parameter (TO-263 column) ΨJB 23.4 °C/W 3

CAD (KiCad official)

  • Symbol: LM7812S2
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263-2 (KiCad packages3D, STEP)
  • 3D model files: lm7812s2-etched.step / lm7812s2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm7812s2.step / lm7812s2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (11 pp, sha256 7c51292380972d4a, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF