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Contents

README

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LM741N

HGSEMI · Operational Amplifier · DIP-8

LM741N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OFFSET NULL passive Offset null terminal; a 10 kΩ potentiometer to V- between pins 1 and 5 trims input offset voltage.
2 INVERTING INPUT input Inverting input; absolute maximum input voltage ±15V (equal to supply if supply is below ±15V), differential input ±30V.
3 NON-INVERTING INPUT input Non-inverting input; absolute maximum input voltage ±15V (equal to supply if supply is below ±15V), differential input ±30V.
4 V- power_in Negative supply pin; supply voltage absolute maximum ±18V total span, and the offset-null potentiometer wiper connects here.
5 OFFSET NULL passive Offset null terminal; connects to the other end of the 10 kΩ offset-nulling potentiometer with pin 1.
6 OUTPUT output Amplifier output with continuous short-circuit protection; typical short-circuit current 25 mA at 25°C.
7 V+ power_in Positive supply pin; supply voltage absolute maximum ±18V.
8 NC unconnected No internal connection.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage -18 18 V 3
Differential Input Voltage -30 30 V 3
Input Voltage -15 15 V Note 3: for supply voltages less than ±15V, the absolute maximum input voltage equals the supply voltage 3
Power Dissipation 500 mW Note 2: derate based on thermal resistance and Tj max 3
Junction Temperature 150 ˚C 3
Soldering Information 260 ˚C 10 seconds 3
Storage Temperature Range -65 150 ˚C 3
ESD Tolerance 400 V 3
Operating Temperature Range 0 70 ˚C 3
Input Offset Current 20 200 nA TA=25˚C 4
Input Bias Current 80 500 nA TA=25˚C 4
Input Resistance 0.3 2 MΩ TA=25˚C, VS=±18V 4
Slew Rate 0.5 V/µs TA=25˚C, Unity Gain 5
Transient Response Rise Time 0.3 µs TA=25˚C, Unity Gain 5
Transient Response Overshoot 5 % TA=25˚C, Unity Gain 5
Thermal Resistance Junction to Ambient (DIP(N)) θjA 100 ˚C/W Junction to Ambient, DIP(N) package 3

CAD (KiCad official)

  • Symbol: LM741N
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: lm741n-etched.step / lm741n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm741n.step / lm741n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (9 pp, sha256 e35f79b267c6a1fd, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF