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Contents

README

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LM5576Q0MHX

Texas Instruments · DC-DC Converters · HTSSOP-20-EP

LM5576Q0MHX from Texas Instruments, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_out Bias regulator output that tracks VIN up to 9V and regulates to 7V above 9V, requires a 0.1µF to 1µF ceramic decoupling capacitor, and can be driven by an external 7.5V to 14V supply to reduce internal power dissipation.
2 SD input Shutdown/UVLO input where below 0.7V the regulator is in low-power shutdown, 0.7V to 1.225V selects standby, above 1.225V enables operation, and an open pin is pulled up by an internal 5µA source; SD must not exceed 14V.
3 VIN power_in Input supply pin with a rated operating range of 6V to 75V (absolute maximum 76V VIN to GND).
4 VIN power_in Input supply pin with a rated operating range of 6V to 75V (absolute maximum 76V VIN to GND); connect in parallel with pin 3.
5 SYNC bidirectional Oscillator synchronization input or output that can be pulled low by an external open-drain clock (pulse width at least 15ns, clock frequency above the RT-set free-running frequency) or tied to other devices' SYNC pins to synchronize them.
6 COMP output Internal error amplifier output where the loop compensation network must be connected between this pin and FB.
7 FB input Feedback input to the inverting input of the error amplifier with a regulation threshold of 1.225V (absolute maximum 7V to GND for FB).
8 RT input Oscillator frequency set pin where a single resistor from RT to AGND sets the switching frequency, which is adjustable from 50kHz to 500kHz.
9 RAMP output Slope-compensation ramp output where an external capacitor from RAMP to AGND sets the current-mode ramp slope, recommended between 50pF and 2000pF.
10 AGND power_in Analog ground serving as the reference for the internal control circuitry and the return for RT, RAMP, and SS components.
11 SS output Soft-start pin where an external capacitor with the internal 10µA source sets the reference ramp time, and the pin is held low during standby, VCC UVLO, and thermal shutdown.
12 OUT output Output voltage connection that connects directly to the regulated output voltage (OUT to GND is limited to VIN).
13 PGND power_in Power ground that serves as the low-side reference for the pre-switch and the IS sense resistor.
14 PGND power_in Power ground that serves as the low-side reference for the pre-switch and the IS sense resistor; connect in parallel with pin 13.
15 IS input Current sense input connected to the recirculating Schottky diode anode, where the internal sense resistor and sample-and-hold circuit read the diode current at the end of the off-time.
16 IS input Current sense input connected to the recirculating Schottky diode anode, where the internal sense resistor and sample-and-hold circuit read the diode current at the end of the off-time; connect in parallel with pin 15.
17 SW output Switch node that is the source of the internal buck switch and must be connected to the external Schottky diode and the buck inductor.
18 SW output Switch node that is the source of the internal buck switch and must be connected to the external Schottky diode and the buck inductor; connect in parallel with pin 17.
19 PRE input Open-drain bootstrap precharge assist pin that can be connected to SW, with an internal precharge MOSFET conducting for 265ns each cycle before the on-time to charge the bootstrap capacitor.
20 BST input Bootstrap input where a 0.022µF ceramic capacitor (recommended) connects between BST and SW, charged from VCC through an internal diode while the buck switch is off.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20-EP
Category Power Supply Chip
Pins 21

CAD (KiCad official)

  • Symbol: LM5576Q0MHX
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lm5576q0mhx-etched.step / lm5576q0mhx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm5576q0mhx.step / lm5576q0mhx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 805d7577975dee6d, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF