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LM53602AQPWPTQ1

Texas Instruments · DC-DC Converters · HTSSOP-16-EP

LM53602AQPWPTQ1 from Texas Instruments, in a HTSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW power_in Regulator switch node for power inductor connection; connect pins 1 and 2 directly at PCB.
2 SW power_in Regulator switch node for power inductor connection; connect pins 1 and 2 directly at PCB.
3 CBOOT power_in Bootstrap supply input for gate drivers; connect high quality 470 nF capacitor to SW.
4 VCC power_out Internal 3.15 V regulator output for internal control circuits; do not connect to external loads.
5 BIAS power_in Input to internal voltage regulator connected to output voltage point; do not ground.
6 SYNC input Synchronization input to regulator for system clock frequency synchronization; connect to GND when not used.
7 FPWM input Mode control input selecting forced PWM (high) or auto PFM/PWM mode (low).
8 RESET output Open drain reset output; high indicates power OK, low indicates fault.
9 FB input Feedback input for output voltage sense (fixed modes) or feedback divider tap (ADJ mode); do not float or ground.
10 AGND power_in Analog ground for regulator and system; all electrical parameters measured with respect to this pin.
11 EN input Enable input to regulator; high enables operation, low disables operation; can connect directly to VIN.
12 VIN power_in Input supply to regulator (3.9 V to 36 V) with high quality bypass capacitor(s) to PGND; connect pins 12 and 13 directly at PCB.
13 VIN power_in Input supply to regulator (3.9 V to 36 V) with high quality bypass capacitor(s) to PGND; connect pins 12 and 13 directly at PCB.
14 N/C unconnected No connection to device.
15 PGND power_in Power ground for internal low side MOSFET; connect to AGND and system ground; connect pins 15 and 16 directly at PCB.
16 PGND power_in Power ground for internal low side MOSFET; connect to AGND and system ground; connect pins 15 and 16 directly at PCB.
17 EP power_in Exposed die attach paddle for adequate heat sinking and noise reduction; connect to ground plane.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-16-EP
Category Power Supply Chip
Pins 17

CAD (KiCad official)

  • Symbol: LM53602AQPWPTQ1
  • Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-16-EP (KiCad packages3D, STEP)
  • 3D model files: lm53602aqpwptq1-etched.step / lm53602aqpwptq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm53602aqpwptq1.step / lm53602aqpwptq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 b2d0d78814aaf2aa, retrieved 2026-10-07, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF