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Contents

README

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LM5157QRTERQ1

TEXAS INSTRUMENTS · DC-DC Converters · WQFN-16(3x3)

LM5157QRTERQ1 from TEXAS INSTRUMENTS, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground pin and source connection of the internal N-channel power MOSFET.
2 VCC power_out Output of the internal VCC regulator and supply input of the internal MOSFET driver, requiring a 5-Ω resistor in series with a 1-µF ceramic bypass capacitor to PGND.
3 BIAS power_in Supply voltage input to the VCC regulator, bypassed to PGND with a capacitor.
4 PGOOD output Open-drain power-good indicator that goes low when FB is below the undervoltage threshold (VUVTH), requiring a pullup resistor to the system rail.
5 RT input Switching frequency setting pin, programmed by a single resistor between RT and AGND.
6 UVLO/SYNC/EN input Enable pin that shuts the converter down when below the enable threshold (VEN), also used for programmable UVLO (must not be left floating, connect to BIAS if unused) and external clock synchronization via a negative pulse input.
7 AGND power_in Analog ground pin, to be connected to the analog ground plane through a wide and short path.
8 COMP output Output of the internal transconductance error amplifier, with loop compensation components connected between this pin and AGND.
9 FB input Inverting input of the error amplifier, fed by a voltage divider that sets the output voltage in boost, SEPIC, or primary-side regulated flyback topologies, with the low-side resistor close to AGND.
10 SS input Soft-start time programming pin, where an external capacitor and internal current source set the error amplifier reference ramp rate, with the capacitor ground returned to AGND.
11 MODE input Mode selection pin, sampled at initial power-up to set hiccup protection and spread spectrum via 0 V/AGND, 37.4 kΩ, 62.0 kΩ, or 100 kΩ resistor (or 370 mV, 620 mV, >1 V levels).
12 SW output Switch pin and drain connection of the internal N-channel power MOSFET.
13 SW output Switch pin and drain connection of the internal N-channel power MOSFET.
14 SW output Switch pin and drain connection of the internal N-channel power MOSFET.
15 NC unconnected No internal electrical contact; optionally connect to PGND for improved thermal conductivity.
16 PGND power_in Power ground pin and source connection of the internal N-channel power MOSFET.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer TEXAS INSTRUMENTS
Package WQFN-16(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
BIAS to AGND -0.3 50 V 7
UVLO to AGND -0.3 V Upper limit printed as VBIAS + 0.3 7
SS, RT to AGND -0.3 3.8 V 7
FB to AGND -0.3 4 V 7
MODE to AGND -0.3 3.8 V 7
PGND to AGND -0.3 0.3 V 7
VCC to AGND -0.3 5.8 V Operating lifetime de-rated when pin voltage is greater than 5.5 V 7
PGOOD to AGND -0.3 18 V 7
COMP to AGND -0.3 V Internal max voltage clamp handles up to 1.6 mA; maximum not printed 7
SW to AGND (DC) -0.3 50 V DC 7
SW to AGND (6 ns transient) -4 V 6 ns transient 7
Junction temperature TJ -40 150 °C High junction temperatures degrade operating lifetimes 7
Storage temperature Tstg -55 150 °C 7
Boost converter input (when BIAS ≥ 2.9 V) VSUPPLY 1.5 45 V when BIAS ≥ 2.9 V 7
Boost converter output VLOAD 48 V Boost converter output can be up to 48 V; VSUPPLY shown as the printed condition 7
BIAS input VBIAS 2.9 45 V 7
UVLO input VUVLO 0 45 V 7
FB input VFB 0 4 V 7
Switch current ISW 0 A Maximum limited by ILIM; see note (4) 7
Typical switching frequency fSW 100 2200 kHz 7
Synchronization pulse frequency fSYNC 100 2200 kHz 7
Operating junction temperature TJ -40 150 °C 8
BIAS shutdown current ISHUTDOWN(BIAS) 2.6 5 μA VBIAS = 12 V, VUVLO = 0 V 8
BIAS operating current IOPERATING(BIAS) 700 775 μA VBIAS = 12 V, VUVLO = 2.0 V, VFB = VREF, RT = 220 kΩ 8
VCC regulation VVCC-REG 4.66 4.9 5.14 V VBIAS = 8 V, IVCC = 18 mA 8
VCC UVLO threshold (rising) VVCC-UVLO(RISING) 2.75 2.8 2.85 V VCC rising 8
Enable threshold (rising) VEN(RISING) 0.4 0.52 0.7 V EN rising 8
Enable threshold (falling) VEN(FALLING) 0.33 0.49 0.63 V EN falling 8
UVLO / SYNC threshold (rising) VUVLO(RISING) 1.425 1.5 1.575 V UVLO rising 8
UVLO / SYNC threshold (falling) VUVLO(FALLING) 1.37 1.45 1.52 V UVLO falling 8
UVLO hysteresis current IUVLO 4 5 6 μA VUVLO = 1.6 V 8
FSW modulation (upper limit) 7.8 % 9
FSW modulation (lower limit) -7.8 % 9
Soft-start current ISS 9 10 11 μA 9
Switching frequency (RT = 220 kΩ) fsw1 85 100 115 kHz RT = 220 kΩ 9
Switching frequency (RT = 49.3 kΩ) fsw2 388 440 492 kHz RT = 49.3 kΩ 9
Switching frequency (RT = 9.09 kΩ) fsw3 1980 2200 2420 kHz RT = 9.09 kΩ 9
Maximum duty cycle limit (DMAX1) DMAX1 80 85 90 % RT = 9.09 kΩ 9
Maximum duty cycle limit (DMAX2) DMAX2 90 93 96 % RT = 220 kΩ 9
Internal MOSFET current limit (LM5157) ILIM 6.5 7.5 8.5 A LM5157 variant 9
FB reference VREF 0.99 1 1.01 V 9
COMP clamp voltage (rising) 2.5 2.8 V COMP rising (VUVLO = 2.0 V) 9
COMP clamp voltage (falling) 1 1.1 V COMP falling 9
Overvoltage threshold (FB rising) VOVTH 107 110 113 % FB rising (referece to VREF) 9
Undervoltage threshold (FB falling) VUVTH 87 90 93 % FB falling (referece to VREF) 9
Internal MOSFET on-resistance (VBIAS = 12 V) rDS(ON) 45 90 mΩ VBIAS = 12 V 9
Internal MOSFET on-resistance (VBIAS = 3.5 V) rDS(ON) 47 95 mΩ VBIAS = 3.5 V 9
Junction-to-ambient thermal resistance RθJA 45.8 °C/W 8
Junction-to-case (top) thermal resistance RθJC(top) 45.3 °C/W 8
Junction-to-board thermal resistance RθJB 20 °C/W 8
Junction-to-top characterization parameter ΨJT 0.8 °C/W 8
Junction-to-board characterization parameter ΨJB 20 °C/W 8
Junction-to-case (bottom) thermal resistance RθJC(bot) 6.9 °C/W 8
Junction-to-ambient thermal resistance (EVM board) RθJA 32.7 °C/W LM5157EVM-BST board 8
Junction-to-top characterization parameter (EVM board) ΨJT 0.6 °C/W LM5157EVM-BST board 8
Junction-to-board characterization parameter (EVM board) ΨJB 14.8 °C/W LM5157EVM-BST board 8

CAD (KiCad official)

  • Symbol: LM5157QRTERQ1
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: lm5157qrterq1-etched.step / lm5157qrterq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm5157qrterq1.step / lm5157qrterq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TEXAS INSTRUMENTS datasheet (49 pp, sha256 b17edbd026370cbb, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF