component
LM50BIM3
Public Made by Adomby adom
Texas Instruments Temperature Sensors, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM50BIM3
Texas Instruments · Temperature Sensors · SOT-23
LM50BIM3 from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | +VS | power_in | Positive supply pin; the LM50 (LM50B/LM50C) is specified for a 4.5 V to 10 V supply, with an absolute maximum of 12 V. |
| 2 | VO | output | Analog temperature sensor output at 10 mV/°C with 500 mV at 0 °C, output impedance 2 kΩ typical and 4 kΩ maximum, and an absolute maximum output current of 10 mA. |
| 3 | GND | power_in | Device ground, connected to the negative supply terminal. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Sensors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Temperature accuracy LM50B (old chip), TA = 25°C | TACY | -2 | 2 | °C | TA = 25°C | 8 | |
| Temperature accuracy LM50B (old chip), TA = TMAX = 100°C | TACY | -3 | 3 | °C | TA = TMAX = 100°C | 8 | |
| Temperature accuracy LM50B (old chip), TA = TMIN = -25°C | TACY | -3.5 | 3 | °C | TA = TMIN = -25°C | 8 | |
| Temperature accuracy LM50B (new chip), TA = 25°C | TACY | -2 | 2 | °C | TA = 25°C | 8 | |
| Temperature accuracy LM50B (new chip), TA = TMAX = 125°C | TACY | -3 | 3 | °C | TA = TMAX = 125°C | 8 | |
| Temperature accuracy LM50B (new chip), TA = TMIN = -40°C | TACY | -3.5 | 3 | °C | TA = TMIN = -40°C | 8 | |
| Sensor gain (temperature coefficient) | TC | 9.7 | 10 | 10.3 | mV/°C | TA = TJ = TMIN to TMAX | 8 |
| Output nonlinearity (LM50) | VONL | -0.8 | 0.8 | °C | TA = TJ = TMIN to TMAX | 8 | |
| Output impedance | ZOUT | 2000 | 4000 | Ω | TA = TJ = TMIN to TMAX | 8 | |
| Long-term stability and drift | TLTD | -0.08 | 0.08 | °C | TJ = 125°C, 1000 hours | 8 | |
| Operating current LM50 (old chip) | IDD | 95 | 180 | μA | TA = TMIN to TMAX, 4.5V ≤ +VS ≤ 10V | 8 | |
| Operating current LM50 (new chip) | IDD | 52 | 90 | μA | TA = TMIN to TMAX, 4.5V ≤ +VS ≤ 10V | 8 | |
| Line regulation (LM50) | PSR | -1.2 | 1.2 | mV/V | TA = TMIN to TMAX, 4.5V ≤ +VS ≤ 10V | 8 | |
| Supply voltage +VS (LM50, absolute maximum) | +VS | -0.2 | 12 | V | 7 | ||
| Output voltage VO (LM50, max = +VS + 0.6 V) | VO | -1 | V | 7 | |||
| Output current IOUT | IOUT | 10 | mA | 7 | |||
| Maximum junction temperature | TJ | 150 | °C | 7 | |||
| Storage temperature (LM50) | Tstg | -65 | 150 | °C | 7 | ||
| Supply voltage +VS (LM50 recommended) | +VS | 4.5 | 10 | V | LM50 (LM50B and LM50C) | 7 | |
| Rated temperature TMIN/TMAX (LM50B old chip) | TMIN, TMAX | -25 | 100 | °C | LM50B old chip | 7 | |
| Rated temperature TMIN/TMAX (LM50B new chip) | TMIN, TMAX | -40 | 125 | °C | LM50B new chip | 7 | |
| Junction-to-ambient thermal resistance (old chip) | RθJA | 291.9 | °C/W | DBZ (SOT-23), 3 pins, old chip | 7 | ||
| Junction-to-ambient thermal resistance (new chip) | RθJA | 240.6 | °C/W | DBZ (SOT-23), 3 pins, new chip | 7 | ||
| Junction-to-case (top) thermal resistance (old chip) | RθJC(top) | 114.3 | °C/W | DBZ (SOT-23), 3 pins, old chip | 7 | ||
| Junction-to-case (top) thermal resistance (new chip) | RθJC(top) | 144.5 | °C/W | DBZ (SOT-23), 3 pins, new chip | 7 | ||
| Junction-to-board thermal resistance (old chip) | RθJB | 62.3 | °C/W | DBZ (SOT-23), 3 pins, old chip | 7 | ||
| Junction-to-board thermal resistance (new chip) | RθJB | 72.3 | °C/W | DBZ (SOT-23), 3 pins, new chip | 7 | ||
| Junction-to-top characterization parameter (old chip) | ψJT | 7.4 | °C/W | DBZ (SOT-23), 3 pins, old chip | 7 | ||
| Junction-to-top characterization parameter (new chip) | ψJT | 28.7 | °C/W | DBZ (SOT-23), 3 pins, new chip | 7 | ||
| Junction-to-board characterization parameter (old chip) | ψJB | 61 | °C/W | DBZ (SOT-23), 3 pins, old chip | 7 | ||
| Junction-to-board characterization parameter (new chip) | ψJB | 71.7 | °C/W | DBZ (SOT-23), 3 pins, new chip | 7 |
CAD (KiCad official)
- Symbol:
LM50BIM3 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
lm50bim3-etched.step/lm50bim3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm50bim3.step/lm50bim3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (36 pp, sha256
ad704d40b9e5a14d, retrieved 2026-10-21, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).