component
LM5088MHX-1
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HTSSOP-16-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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LM5088MHX-1
Texas Instruments · DC-DC Converters · HTSSOP-16-EP
LM5088MHX-1 from Texas Instruments, in a HTSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Input supply voltage with an operating range of 4.5 V to 75 V. |
| 2 | EN | input | Below 0.4 V the regulator is in a low-power state, 0.4 V to 1.2 V selects standby mode, and above 1.2 V the controller is operational; a 5-µA pullup forces high when left open. |
| 3 | SS | passive | An internal 11-µA source charges the external capacitor to set the start-up rate, and the pin is held low in standby, VCC UV and thermal shutdown states. |
| 4 | RAMP | passive | An external capacitor between RAMP and GND sets the emulated current-mode ramp slope, with a recommended range of 100 pF to 2000 pF. |
| 5 | RT/SYNC | input | A single resistor to GND programs the oscillator from 50 kHz to 1 MHz, and an external sync signal higher in frequency can be applied through a small coupling capacitor while the RT resistor remains required. |
| 6 | GND | power_in | Ground return. |
| 7 | COMP | output | Output of the internal error amplifier, with the loop compensation network connected between COMP and FB. |
| 8 | FB | input | Inverting input of the internal error amplifier with a regulation threshold of 1.205 V. |
| 9 | OUT | input | Connect directly to the regulated output voltage. |
| 10 | DITH | passive | A capacitor to GND charged and discharged by 27-µA sources modulates the oscillator between -5% and +5% of nominal, and grounding the pin disables dithering. |
| 11 | CSG | passive | Low-side reference for the current sense resistor. |
| 12 | CS | input | Current measurement connection for the re-circulating diode that senses diode current at the end of the buck switch off time to provide the DC offset of the emulated ramp. |
| 13 | SW | passive | Connect to the source terminal of the external MOSFET switch. |
| 14 | HG | output | Connect to the gate terminal of the external MOSFET switch. |
| 15 | BOOT | power_in | An external bootstrap capacitor between BOOT and SW provides gate-driver bias and is charged from VCC through an internal diode during the buck off-time. |
| 16 | VCC | power_out | Bias regulator output that tracks VIN up to 7.8 V typical and requires a 0.1-µF to 10-µF ceramic decoupling capacitor, with an external 8.3 V to 13 V supply optionally applied to reduce dissipation. |
| 17 | EP | passive | Electrically isolated exposed pad that must be soldered to the ground plane to reduce thermal resistance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-16-EP |
| Category | Power Management (PMIC) |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN voltage | VIN | 4.5 | 75 | V | 5 | ||
| VCC voltage (externally supplied) | VCC | 8.3 | 13 | V | 5 | ||
| Operation junction temperature | TJ | -40 | 125 | °C | 5 | ||
| VIN, VOUT to GND | VIN, VOUT | 76 | V | to GND | 5 | ||
| BOOT to GND | BOOT | 90 | V | to GND | 5 | ||
| SW to GND | SW | -2 | 76 | V | to GND | 5 | |
| VCC to GND | VCC | -0.3 | 16 | V | to GND | 5 | |
| HG to SW | HG | -0.3 | V | to SW; max printed as BOOT + 0.3 V | 5 | ||
| EN to GND | EN | 14 | V | to GND | 5 | ||
| BOOT to SW | BOOT | -0.3 | 16 | V | to SW | 5 | |
| CS, CSG to GND | CS, CSG | -0.3 | 0.3 | V | to GND | 5 | |
| All other inputs to GND | -0.3 | 7 | V | to GND | 5 | ||
| Junction temperature | TJ | 150 | °C | 5 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| VIN operating current | IBIAS | 5.5 | mA | VFB = 1.3 V, TJ = -40°C to +125°C | 6 | ||
| VIN standby current | ISTANDBY | 3.6 | mA | VEN = 1 V, TJ = -40°C to +125°C | 6 | ||
| VIN shutdown current | ISHUTDOWN | 26 | µA | VEN = 0 V, TJ = -40°C to +125°C | 6 | ||
| VCC regulation | VVCC(Reg) | 7.4 | 7.8 | 8.2 | V | VVCC = open | 6 |
| VCC sourcing current limit | 30 | mA | VVCC = 0 | 6 | |||
| EN shutdown threshold | VEN | 320 | 400 | 480 | mV | VEN rising | 6 |
| EN standby threshold | VEN | 1.1 | 1.2 | 1.3 | V | VEN rising | 6 |
| SS pullup current source | ISS | 8 | 11 | 13 | µA | VSS = 0 V | 6 |
| VREF FB reference voltage | VREF | 1.187 | 1.205 | 1.223 | V | Measured at FB pin; FB = COMP | 6 |
| FB input bias current | IFB | 18 | 100 | nA | VFB = 1.2 V | 6 | |
| Forced HG off time | tHG(OFF) | 185 | 280 | 365 | ns | 6 | |
| Dithering range (fmin = fnom - 5%, fmax = fnom + 5%) | fdither | -5 | 5 | % | LM5088-1 dithering, relative to fnom | 7 | |
| SYNC pulse width | 15 | 150 | ns | 7 | |||
| Cycle-by-cycle sense voltage threshold | VCS(TH) | 112 | 120 | 136 | mV | VRAMP = 0 V | 7 |
| RES threshold upper (rising) | Vresup | 1.1 | 1.2 | 1.3 | V | VCS = 0.125 V | 7 |
| RES threshold lower (falling) | Vresdown | 0.1 | 0.2 | 0.3 | V | 7 | |
| Charge source current | Icharge | 40 | 50 | 65 | µA | VCS ≥ 0.125 V | 7 |
| Discharge sink current | Idischarge | 20 | 27 | 34 | µA | VCS < 0.125 V | 7 |
| Discharge sink current (post fault) | Irampdown | 0.8 | 1.2 | 1.6 | µA | 7 | |
| RAMP current 1 | IRAMP1 | 235 | 295 | 345 | µA | VVIN = 60 V, VOUT = 10 V | 7 |
| RAMP current 2 | IRAMP2 | 18 | 25 | 30 | µA | VVIN = 10 V, VOUT = 10 V | 7 |
| HG low-state output voltage | VOLH | 115 | 215 | mV | IHG = 100 mA | 7 | |
| VOUT bias current | IVOUT | 250 | µA | VOUT = 48 V | 7 | ||
| VCC undervoltage hysteresis | 200 | mV | 6 | ||||
| EN shutdown hysteresis | 100 | mV | VEN falling | 6 | |||
| EN standby hysteresis | 120 | mV | VEN falling | 6 | |||
| EN pullup current source | IEN | 5 | µA | VEN = 0 V | 6 | ||
| FB to SS offset | 150 | mV | VFB = 1.3 V | 6 | |||
| COMP sink and source current | 3 | mA | 6 | ||||
| Minimum HG on time | tON(MIN) | 55 | ns | VVIN = 60 V | 6 | ||
| COMP to PWM comparator offset | 930 | mV | 6 | ||||
| SYNC positive threshold | 2.3 | V | 7 | ||||
| Cycle-by-cycle current limit delay | 280 | ns | VRAMP = 2.5 V | 7 | |||
| Buck switch VDS protection | 1.5 | V | VIN to SW | 7 | |||
| RAMP output low voltage | 200 | mV | VVIN = 60 V, VOUT = 10 V | 7 | |||
| HG high-state output voltage | VOHH | 240 | mV | IHG = -100 mA, VOHH = VBOOT - VHG | 7 | ||
| HG rise time | 12 | ns | Cload = 1000 pF | 7 | |||
| HG fall time | 6 | ns | Cload = 1000 pF | 7 | |||
| Peak HG source current | IOHH | 1.5 | A | VHG = 0 V | 7 | ||
| Peak HG sink current | IOLH | 2 | A | VHG = VVCC | 7 | ||
| BOOT UVLO | 3 | V | BOOT to SW | 7 | |||
| Pre-charge switch ON resistance | RDS(ON) | 72 | Ω | IVCC = 1 mA | 7 | ||
| Pre-charge switch on time | 300 | ns | 7 | ||||
| Thermal shutdown temperature | TSD | 165 | °C | Junction temperature rising | 7 | ||
| Junction-to-ambient thermal resistance | RθJA | 40 | °C/W | PWP 16-pin package | 6 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 6 | °C/W | PWP 16-pin package | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | power ground connections (CSS, RT, and CRAMP) directly to the regulator GND pin. Connect the GND pin and PGND pins together through to top-side copper area covering the entire underside of the device. | 34 |
CAD (KiCad official)
- Symbol:
LM5088MHX-1 - Footprint:
Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm - 3D model: HTSSOP-16-EP (KiCad packages3D, STEP)
- 3D model files:
lm5088mhx-1-etched.step/lm5088mhx-1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm5088mhx-1.step/lm5088mhx-1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (45 pp, sha256
471a76480f35dc1d, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).