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Contents

README

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LM5010AMHX

Texas Instruments · DC-DC Converters · HTSSOP-14-EP

LM5010AMHX from Texas Instruments, in a HTSSOP-14-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection; can be connected to ground plane to improve heat dissipation.
2 SW output Switching node output internally connected to the buck switch source; connects to inductor, freewheeling diode, and bootstrap capacitor.
3 BST input Bootstrap capacitor pin charged from VCC through an internal diode during the buck switch OFF-time.
4 ISEN input Current sense input where inductor current flows through internal 50 mΩ sense resistor with 1.25 A typical threshold for current limiting.
5 SGND power_in Sense ground where recirculating inductor current flows into this pin through the internal sense resistor.
6 RTN power_in Circuit ground return for all internal circuitry other than the current sense resistor.
7 NC unconnected No connection; can be connected to ground plane to improve heat dissipation.
8 NC unconnected No connection; can be connected to ground plane to improve heat dissipation.
9 FB input Voltage feedback input to regulation and overvoltage comparators with 2.5 V regulation level and 2.9 V overvoltage threshold.
10 SS input Soft-start pin charged by an internal 11.5 µA current source to 2.5 V for gradual output voltage ramp during startup.
11 RON/SD input ON-time control and shutdown pin where external resistor from VIN to this pin sets buck switch ON-time; grounding shuts down regulator.
12 VCC power_out Bias regulator output nominally equal to VIN for VIN < 8.9 V and regulated at 7 V for VIN > 8.9 V; requires 0.47 µF minimum bypass capacitor.
13 VIN power_in Input supply pin with nominal range 6 V to 75 V; input bypass capacitors must be located as close as possible to VIN and RTN pins.
14 NC unconnected No connection; can be connected to ground plane to improve heat dissipation.
15 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-14-EP
Category Power Management (PMIC)
Pins 15

CAD (KiCad official)

  • Symbol: LM5010AMHX
  • Footprint: Package_SO:TSSOP-14-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-14-EP (KiCad packages3D, STEP)
  • 3D model files: lm5010amhx-etched.step / lm5010amhx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm5010amhx.step / lm5010amhx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (36 pp, sha256 1f25e7679e7d28d0, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF