LM5009AMM from Texas Instruments, in a VSSOP-8-0.65mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	SW	output	Switching node is the power switching node that connects to the output inductor, recirculating diode, and bootstrap capacitor.
2	BST	input	Bootstrap capacitor input requires an external capacitor between BST and SW, with 0.01-µF ceramic recommended, charged from VCC through an internal diode during each OFF time.
3	RCL	input	Current limit OFF-time set pin where a resistor to RTN sets the OFF time during current limit, preset to 35 µs when FB = 0 V.
4	RTN	power_in	Ground pin serves as ground for the entire circuit.
5	FB	input	Feedback input connects to the inverting input of the internal regulation comparator with a regulation threshold of 2.5 V.
6	RT/SD	input	On-time set pin where a resistor to VIN sets the switch on time versus VIN, with a minimum recommended on time of 400 ns at maximum input voltage, and which also serves as remote shutdown.
7	VCC	power_out	Output of the internal high-voltage series pass regulator provides gate drive power for the internal buck switch, is current limited to 9 mA, and requires a local 0.47-µF decoupling capacitor.
8	VIN	power_in	Input voltage pin with an operating range of 6 V to 95 V.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	VSSOP-8-0.65mm
Category	Power Management (PMIC)
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VIN to GND		-0.3		100	V		4
BST to GND		-0.3		114	V		4
SW to GND (steady state)		-1			V		4
BST to VCC				100	V		4
BST to SW				14	V		4
VCC to GND				14	V		4
All other inputs to GND		-0.3		7	V		4
Storage temperature	Tstg	-55		150	°C		4
Input voltage	VIN	6		95	V		4
Operating junction temperature	TJ	-40		125	°C		4
VCC regulator output		6.6	7	7.4	V	VIN = 48 V	5
Iin operating current	Iin		550	750	µA	FB = 3 V, VIN = 48 V	5
Iin shutdown current	Iin		110	176	µA	RT/SD = 0 V	5
Current limit threshold		0.24	0.3	0.36	A		5
TON-1 ON-time generator	TON-1	2.15	2.77	3.5	µs	VIN = 10 V, RON = 200 K	5
TON-2 ON-time generator	TON-2	200	300	420	ns	VIN = 95 V, RON = 200 K	5
Remote shutdown threshold	RT/SD	0.4	0.7	1.05	V	Rising	5
FB reference threshold		2.445	2.5	2.55	V	Internal reference, trip point for switch ON	5
Gate drive UVLO		2.8	3.8	4.8	V	Vbst, Vsw rising	6
Buck switch RDS(ON)	RDS(ON)		2.2	4.6	Ω	Itest = 200 mA	6
VIN, VCC			100		mV	6 V < VIN < 8.5 V	5
VCC bypass threshold			8.5		V	VIN increasing	5
VCC bypass hysteresis			300		mV		5
VCC output impedance			100		Ω	VIN = 6 V	5
VCC output impedance			8.8		Ω	VIN = 10 V	5
VCC output impedance			0.8		Ω	VIN = 48 V	5
VCC current limit			9.2		mA	VIN = 48 V	5
VCC UVLO			5.3		V	VCC increasing	5
VCC UVLO hysteresis			190		mV		5
VCC UVLO filter delay			3		µs		5
Current limit response time			350		ns	Iswitch overdrive = 0.1 A, time to switch off	5
TOFF-1 OFF-time generator	TOFF-1		35		µs	FB = 0 V, RCL = 100 K	5
TOFF-2 OFF-time generator	TOFF-2		2.56		µs	FB = 2.3 V, RCL = 100 K	5
RT/SD remote shutdown hysteresis	RT/SD(HYS)		35		mV		5
Minimum off timer			300		ns	FB = 0 V	5
FB overvoltage threshold			2.875		V	Trip point for switch OFF	5
FB bias current			100		nA		5
Thermal shutdown temperature	TSD		165		°C		5
Thermal shutdown hysteresis			25		°C		5
Precharge switch voltage			0.8		V	At 1 mA	6
Precharge switch ON time			150		ns		6
Gate drive UVLO hysteresis			490		mV		6
Junction-to-ambient thermal resistance (DGK)	RθJA		157.7		°C/W	DGK (VSSOP) package	4
Junction-to-case (top) thermal resistance (DGK)	RθJC(top)		50.2		°C/W	DGK (VSSOP) package	4
Junction-to-board thermal resistance (DGK)	RθJB		77.9		°C/W	DGK (VSSOP) package	4
Junction-to-top characterization parameter (DGK)	ψJT		4.5		°C/W	DGK (VSSOP) package	4
Junction-to-board characterization parameter (DGK)	ψJB		76.5		°C/W	DGK (VSSOP) package	4

CAD (KiCad official)

Symbol: LM5009AMM
Footprint: Package_SO:VSSOP-8_2.3x2mm_P0.5mm
3D model: VSSOP-8-0.65mm (KiCad packages3D, STEP)
3D model files: lm5009amm-etched.step / lm5009amm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm5009amm.step / lm5009amm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (30 pp, sha256 9fc4082d8b7a33e9, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

LM5009AMM

Verified LM5009AMM

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3D Model

Symbol & Footprint

Schematic Symbol

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Datasheet

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