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LM4819MMX

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Texas Instruments Audio Amplifiers, VSSOP-8. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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LM4819MMX

Texas Instruments · Audio Amplifiers · VSSOP-8

LM4819MMX from Texas Instruments, in a VSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input Active-high logic input that activates micro-power shutdown when driven toward VDD (VSDIH ≥ 4.0 V min at 5 V, VSDIL ≤ 1.0 V max; threshold typ 1/2 VDD); shutdown current typ 0.7 µA; must not be left floating.
2 BYPASS passive Internal half-supply bias bypass pin; an external capacitor CB (≥ 1.0 µF recommended) to GND filters the reference and sets amplifier turn-on time (TON ≈ 2 s with CB = 1.0 µF).
3 +IN input Non-inverting signal input to the first internal amplifier; input voltage range −0.3 V to VDD + 0.3 V; AC-coupled via input capacitor Ci and input resistor Ri.
4 -IN input Inverting signal input to the first internal amplifier; gain-setting feedback resistor RF and input resistor Ri connect here to set closed-loop differential gain AVD = 2(RF/Ri).
5 Vo2 output Bridge output of the second (inverting) internal amplifier, 180° out of phase with Vo1; one end of the speaker load connects between Vo1 and Vo2; output offset voltage typ 5 mV, max 50 mV.
6 GND power_in Ground reference pin; all voltages measured with respect to this pin; supply bypassing capacitors should be placed as close as possible to the device with their ground returns here.
7 VDD power_in Power supply pin; operating range 2.0 V to 5.5 V (abs max 6.0 V); quiescent current typ 1.5 mA, max 3.0 mA at 5 V; bypass with 0.1 µF and 10 µF capacitors to GND placed close to the device.
8 Vo1 output Bridge output of the first (non-inverting) internal amplifier; drives the load differentially with Vo2; rated 350 mW into 16 Ω or 300 mW into 8 Ω at 10% THD+N from a 5 V supply.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSSOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Quiescent Power Supply Current (VDD = 5V) IDD 1.5 3 mA VDD = 5V; VIN = 0V, Io = 0A 4
Quiescent Power Supply Current (VDD = 3V) IDD 1 3 mA VDD = 3V; VIN = 0V, Io = 0A 4
Shutdown Current (VDD = 5V) ISD 1 5 µA VDD = 5V; VPIN1 = VDD 4
Shutdown Current (VDD = 3V) ISD 0.7 5 µA VDD = 3V; VPIN1 = VDD 4
Shutdown Voltage Input High (VDD = 5V) VSDIH 4 V VDD = 5V 4
Shutdown Voltage Input Low (VDD = 5V) VSDIL 1 V VDD = 5V 4
Shutdown Voltage Input High (VDD = 3V) VSDIH 2.4 V VDD = 3V 4
Shutdown Voltage Input Low (VDD = 3V) VSDIL 0.6 V VDD = 3V 4
Output Offset Voltage (VDD = 5V) VOS 5 50 mV VDD = 5V; VIN = 0V 4
Output Offset Voltage (VDD = 3V) VOS 5 50 mV VDD = 3V; VIN = 0V 4
Supply Voltage 6 V 3
Input Voltage -0.3 V Upper limit printed as VDD +0.3V 3
Storage Temperature -65 150 °C 3
Junction Temperature TJ 150 °C 3
Soldering Information, Vapor Phase 215 °C Small outline package, vapor phase, 60 seconds 3
Soldering Information, Infrared 220 °C Small outline package, infrared, 15 seconds 3
ESD Susceptibility (Human Body Model) 3.5 kV Human body model, 100pF discharged through 1.5 kΩ 3
ESD Susceptibility (Machine Model) 250 V Machine model, 220pF-240pF discharged through all pins 3
Operating Temperature Range TA -40 85 °C 3
Supply Voltage VCC 2 5.5 V 3
Thermal Resistance Junction-to-Case (VSSOP) θJC 56 °C/W VSSOP package 3
Thermal Resistance Junction-to-Ambient (VSSOP) θJA 210 °C/W VSSOP package, typical when board mounted 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper (6) Machine Model, 220pF-240pF capacitor is discharged through all pins. (7) The given θJA is for an LM4819 package in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad w 3

CAD (KiCad official)

  • Symbol: LM4819MMX
  • Footprint: Package_SO:VSSOP-8_2.3x2mm_P0.5mm
  • 3D model: VSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: lm4819mmx-etched.step / lm4819mmx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm4819mmx.step / lm4819mmx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 c76a582050c5d98c, retrieved 2026-10-20, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF