component
LM4673SD
Public Made by Adomby adom
Texas Instruments Audio Power OpAmps, WSON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM4673SD
Texas Instruments · Audio Power OpAmps · WSON-8-EP(3x3)
LM4673SD from Texas Instruments, in a WSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN+ | input | Non-inverting differential audio input, with gain set by external Ri (AV = 2*150kΩ/Ri). |
| 2 | IN- | input | Inverting differential audio input, with gain set by external Ri (AV = 2*150kΩ/Ri). |
| 3 | VDD | power_in | Supply voltage pin for 2.4V to 5.5V operation, bypassed with a 4.7µF capacitor placed close to the device. |
| 4 | SHDN | input | Active-low shutdown input (logic high min 1.4V, logic low max 0.4V) with internal 300kΩ resistor to GND, so floating enters shutdown. |
| 5 | VO1 | output | Class D differential speaker output 1, switching at 300kHz between VDD and GND. |
| 6 | GND | power_in | Ground pin. |
| 7 | PVDD | power_in | Power supply for the output stage, connected to the same 2.4V to 5.5V supply as VDD. |
| 8 | VO2 | output | Class D differential speaker output 2, switching at 300kHz between VDD and GND. |
| 9 | EP | passive | Exposed thermal pad that must be soldered to the PCB for thermal and mechanical performance; the datasheet does not state its net. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(3x3) |
| Category | Amplifiers |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Differential Output Offset Voltage | VOS | 5 | mV | VI = 0V, AV = 2V/V, VDD = 2.4V to 5.0V | 4 | ||
| Logic High Input Current | IIH | 17 | 100 | μA | VDD = 5.0V, VI = 5.5V | 4 | |
| Logic Low Input Current | IIL | 0.9 | 5 | μA | VDD = 5.0V, VI = -0.3V | 4 | |
| Quiescent Power Supply Current | IDD | 2.6 | 3.75 | mA | VIN = 0V, No Load, VDD = 5.0V | 4 | |
| Quiescent Power Supply Current | IDD | 2.1 | 2.9 | mA | VIN = 0V, No Load, VDD = 3.6V | 4 | |
| Quiescent Power Supply Current | IDD | 1.7 | 2.3 | mA | VIN = 0V, No Load, VDD = 2.4V | 4 | |
| Shutdown Current | ISD | 0.01 | 1 | μA | VSHUTDOWN = 0V, VDD = 2.4V to 5.0V | 4 | |
| Shutdown voltage input high | VSDIH | 1.4 | V | 4 | |||
| Shutdown voltage input low | VSDIL | 0.4 | V | 4 | |||
| Output Power (1% THD, 8Ω, 3.6V) | PO | 600 | 650 | mW | RL = 15μH + 8Ω + 15μH, THD = 1%, f = 1kHz, 22kHz BW, VDD = 3.6V | 5 | |
| Supply Voltage (absolute maximum) | VDD | 6 | V | 3 | |||
| Storage Temperature | Tstg | -65 | 150 | °C | 3 | ||
| Junction Temperature | TJMAX | 150 | °C | 3 | |||
| ESD Susceptibility, all other pins | 2 | kV | Human body model, 100pF, 1.5kΩ | 3 | |||
| ESD Susceptibility | 200 | V | Machine Model, 220pF-240pF | 3 | |||
| Operating Temperature | TA | -40 | 85 | °C | TMIN ≤ TA ≤ TMAX | 3 | |
| Supply Voltage | VDD | 2.4 | 5.5 | V | 3 | ||
| Thermal Resistance Junction-to-Ambient (WSON) | θJA | 73 | °C/W | WSON | 3 | ||
| Output Impedance in shutdown | ROSD | 100 | kΩ | VSHUTDOWN = 0.4V | 4 | ||
| Resistance from Shutdown Pin to GND | RSD | 300 | kΩ | 4 | |||
| Power Supply Rejection Ratio | PSRR | 78 | dB | VRipple = 200mVPP, fRipple = 217Hz, VDD = 3.6, 5V, CI = 2μF | 5 | ||
| Wake-up Time | TWU | 17 | μs | VDD = 3.6V | 5 | ||
| Shutdown Time | TSD | 140 | μs | 5 |
CAD (KiCad official)
- Symbol:
LM4673SD - Footprint:
Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm - 3D model: WSON-8-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
lm4673sd-etched.step/lm4673sd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm4673sd.step/lm4673sd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (30 pp, sha256
0345b49ca3f5f539, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).