component
LM43601AQPWPRQ1
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Texas Instruments DC-DC Converters, HTSSOP-16-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM43601AQPWPRQ1
Texas Instruments · DC-DC Converters · HTSSOP-16-EP
LM43601AQPWPRQ1 from Texas Instruments, in a HTSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | power_out | Switching output of the regulator, internally connected to both power MOSFETs, to be connected to the power inductor. |
| 2 | SW | power_out | Switching output of the regulator, internally connected to both power MOSFETs, to be connected to the power inductor. |
| 3 | CBOOT | passive | Bootstrap capacitor connection for the high-side driver, where a high-quality 470-nF capacitor is connected from CBOOT to SW. |
| 4 | VCC | power_out | Internal bias supply output for bypassing, with a bypass capacitor connected from this pin to AGND; no external load may be connected and the pin must never be shorted to ground during operation. |
| 5 | BIAS | power_in | Optional internal LDO supply input, recommended tied to VOUT for 3.3 V ≤ VOUT ≤ 28 V or to an external 3.3-V or 5-V rail, with a 1 to 10 µF bypass to ground, and tied to ground when not used. |
| 6 | SYNC | input | Clock input that synchronizes switching to an external clock, requiring proper high-speed termination to prevent ringing, and it must be connected to ground if not used and not left floating. |
| 7 | RT | passive | Resistor RT connected from this pin to AGND programs the switching frequency, and the pin is left floating for the 500 kHz default. |
| 8 | PGOOD | output | Open-drain power-good flag output that requires a 10-kΩ to 100-kΩ pullup to a logic rail or DC voltage no higher than 12 V. |
| 9 | FB | input | Feedback sense input connected to the midpoint of the feedback divider to set VOUT, and must not be shorted to ground during operation. |
| 10 | AGND | power_in | Analog ground pin serving as ground reference for internal references and logic, to be connected to system ground. |
| 11 | SS/TRK | input | Soft-start control pin that is left floating for the internal soft-start slew rate, connected to a capacitor to extend soft-start time, or connected to an external voltage ramp for tracking. |
| 12 | EN | input | Enable input where high turns the device ON and low turns it OFF, connected to VIN, a resistor divider, or an external voltage or logic source, and must not be left floating. |
| 13 | VIN | power_in | Supply input pin to the internal LDO and high-side power FET, requiring bypass capacitors CIN with the VIN-to-CIN-to-PGND path kept as short as possible. |
| 14 | VIN | power_in | Supply input pin to the internal LDO and high-side power FET, requiring bypass capacitors CIN with the VIN-to-CIN-to-PGND path kept as short as possible. |
| 15 | PGND | power_in | Power ground pin connected internally to the low-side power FET, to be connected to system ground, PAD, AGND, and the ground pins of CIN and COUT with a short path to CIN. |
| 16 | PGND | power_in | Power ground pin connected internally to the low-side power FET, to be connected to system ground, PAD, AGND, and the ground pins of CIN and COUT with a short path to CIN. |
| 17 | PAD | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HTSSOP-16-EP |
| Category | Power Supply Chip |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN to PGND | -0.3 | 42 | V | 4 | |||
| EN to PGND | -0.3 | V | 4 | ||||
| FB, RT, SS/TRK to AGND | -0.3 | 3.6 | V | 4 | |||
| PGOOD to AGND | -0.3 | 15 | V | 4 | |||
| SYNC to AGND | -0.3 | 5.5 | V | 4 | |||
| BIAS to AGND | -0.3 | 30 | V | 4 | |||
| AGND to PGND | -0.3 | 0.3 | V | 4 | |||
| SW to PGND | -0.3 | V | 4 | ||||
| SW to PGND less than 10-ns transients | -3.5 | 42 | V | 4 | |||
| CBOOT to SW | -0.3 | 5.5 | V | 4 | |||
| VCC to AGND | -0.3 | 3.6 | V | 4 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 4 | ||
| VIN to PGND | 3.5 | 36 | V | 4 | |||
| EN | -0.3 | V | 4 | ||||
| FB | -0.3 | 1.1 | V | 4 | |||
| PGOOD | -0.3 | 12 | V | 4 | |||
| BIAS input not used | -0.3 | 0.3 | V | 4 | |||
| BIAS input used | 3.3 | V | 4 | ||||
| AGND to PGND | -0.1 | 0.1 | V | 4 | |||
| Output voltage | VOUT | 1 | 28 | V | 4 | ||
| Output current | IOUT | 0 | 1 | A | 4 | ||
| Operating junction temperature range | TJ | -40 | 125 | °C | 4 | ||
| Minimum input voltage for start-up | VIN-MIN-ST | 3.8 | V | 5 | |||
| Shutdown quiescent current | ISHDN | 1.1 | 3.1 | µA | VEN = 0 V | 5 | |
| Operating quiescent current (non-switching) from VIN | IQ-NONSW | 6 | 11 | µA | VEN = 3.3 V, VFB = 1.5 V, VBIAS = 3.4 V external | 5 | |
| Operating quiescent current (non-switching) from external VBIAS | IBIAS-NONSW | 85 | 140 | µA | VEN = 3.3 V, VFB = 1.5 V, VBIAS = 3.4 V external | 5 | |
| Precision enable level for switching and regulator output: VOUT | VEN-VOUT-H | 2 | 2.1 | 2.42 | V | VENABLE high level | 5 |
| Enable input leakage current | ILKG-EN | 0.8 | 1.75 | µA | VEN = 3.3 V | 5 | |
| Internal LDO input change over threshold to BIAS | VBIAS-ON | 2.96 | 3.2 | V | VBIAS rising threshold | 5 | |
| Feedback voltage, TJ = 25ºC | VFB | 1.009 | 1.016 | 1.023 | V | TJ = 25ºC | 6 |
| Feedback voltage, TJ = -40ºC to 125ºC | VFB | 0.999 | 1.016 | 1.039 | V | TJ = -40ºC to 125ºC | 6 |
| Input leakage current at FB pin | ILKG-FB | 0.2 | 65 | nA | FB = 1.016 V | 6 | |
| Peak inductor current limit | IHS-LIMIT | 2.07 | 2.45 | 2.71 | A | 6 | |
| Valley inductor current limit | ILS-LIMIT | 0.94 | 1.1 | 1.25 | A | 6 | |
| Soft-start charge current | ISSC | 1.17 | 2.2 | 2.85 | µA | 6 | |
| Power-good flag overvoltage tripping threshold | VPGOOD-HIGH | 110 | 113 | % | % of FB voltage | 6 | |
| Power-good flag undervoltage tripping threshold | VPGOOD-LOW | 83 | 90 | % | % of FB voltage | 6 | |
| PGOOD pin pulldown resistance when power bad (LM43601A-Q1) | RPGOOD | 69 | 150 | Ω | LM43601A-Q1: VEN = 3.3 V | 6 | |
| PGOOD pin pulldown resistance when power bad (LM43601A-Q1) | RPGOOD | 150 | 350 | Ω | LM43601A-Q1: VEN = 0 V | 6 | |
| Minimum high side MOSFET ON-time | TON-MIN | 125 | 165 | ns | 7 | ||
| Minimum high side MOSFET OFF-time | TOFF-MIN | 200 | 250 | ns | 7 | ||
| Oscillator default frequency | FOSC-DEFAULT | 445 | 500 | 570 | kHz | RT pin open circuit | 7 |
| Minimum adjustable frequency | FADJ | 200 | kHz | With 1% resistors at RT pin | 7 | ||
| Maximum adjustable frequency | 2200 | kHz | 7 | ||||
| Frequency adjust accuracy | -10 | 10 | % | 7 | |||
| Sync clock high level threshold | VSYNC-HIGH | 2 | V | 7 | |||
| Sync clock low level threshold | VSYNC-LOW | 0.4 | V | 7 | |||
| Sync clock maximum duty cycle | DSYNC-MAX | 90 | % | 7 | |||
| Sync clock minimum duty cycle | DSYNC-MIN | 10 | % | 7 | |||
| Minimum sync clock ON- and OFF-time | TSYNC-MIN | 80 | ns | 7 | |||
| Internal LDO output voltage VCC | VCC | 3.3 | V | VIN ≥ 3.8 V | 5 | ||
| Voltage level to enable the internal LDO output VCC | VEN-VCC-H | 1.2 | V | VENABLE high level | 5 | ||
| Operating quiescent current (switching) | IQ-SW | 33 | µA | VEN = 3.3 V; IOUT = 0 A; RT = open; VBIAS = VOUT = 3.3 V; RFBT = 1 Meg | 5 | ||
| Thermal shutdown threshold | TSD | 160 | ºC | Shutdown threshold | 6 | ||
| High-side MOSFET ON-resistance | RDS-ON-HS | 419 | mΩ | IOUT = 1 A; VBIAS = VOUT = 3.3 V | 6 | ||
| Low-side MOSFET ON-resistance | RDS-ON-LS | 231 | mΩ | IOUT = 1 A; VBIAS = VOUT = 3.3 V | 6 | ||
| Junction-to-ambient thermal resistance | RθJA | 39.9 | °C/W | JESD 51-7, 4-layer board, 1 W power dissipation | 5 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 26.9 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 21.7 | °C/W | 5 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 2.3 | °C/W | 5 |
CAD (KiCad official)
- Symbol:
LM43601AQPWPRQ1 - Footprint:
Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm - 3D model: HTSSOP-16-EP (KiCad packages3D, STEP)
- 3D model files:
lm43601aqpwprq1-etched.step/lm43601aqpwprq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm43601aqpwprq1.step/lm43601aqpwprq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (51 pp, sha256
b035d735bd2ad002, retrieved 2026-10-12, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).