component
LM4140BCM-2.5
Public Made by Adomby adom
Texas Instruments Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM4140BCM-2.5
Texas Instruments · Voltage Reference · SOIC-8
LM4140BCM-2.5 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Ground | power_in | Negative supply or ground connection. These pins must be connected to ground. |
| 2 | VIN | power_in | Positive supply. |
| 3 | Enable | input | Pulled to input for normal operation. Forcing this pin to ground turns off the output. |
| 4 | Ground | power_in | Negative supply or ground connection. These pins must be connected to ground. |
| 5 | NC | unconnected | This pin must be left open. |
| 6 | VREF | power_in | Reference output. Capable of sourcing up to 8 mA. |
| 7 | Ground | power_in | Negative supply or ground connection. These pins must be connected to ground. |
| 8 | Ground | power_in | Negative supply or ground connection. These pins must be connected to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output voltage initial accuracy | VREF | -0.1 | 0.1 | % | All versions | 5 | |
| Temperature coefficient (B grade) | TCVREF/°C | 6 | ppm/°C | 0°C ≤ TA ≤ 70°C, B grade | 5 | ||
| Line regulation | ΔVREF/ΔVIN | 20 | 200 | ppm/V | All other voltage options, Vref + 200 mV ≤ VIN ≤ 5.5 V, TA = 25°C | 5 | |
| Line regulation | ΔVREF/ΔVIN | 250 | ppm/V | All other voltage options, Vref + 200 mV ≤ VIN ≤ 5.5 V, 0°C ≤ TA ≤ 70°C | 5 | ||
| Load regulation | ΔVREF/ΔILOAD | 1 | 20 | ppm/mA | All other voltage options, 1 mA ≤ ILOAD ≤ 8 mA, TA = 25°C | 5 | |
| Load regulation | ΔVREF/ΔILOAD | 150 | ppm/mA | All other voltage options, 1 mA ≤ ILOAD ≤ 8 mA, 0°C ≤ TA ≤ 70°C | 5 | ||
| Long-term stability | ΔVREF | 60 | ppm | 1000 hours | 5 | ||
| Thermal hysteresis | ΔVREF | 20 | ppm | 0°C ≤ TA ≤ +70°C | 5 | ||
| Dropout voltage | VIN-VREF | 20 | 40 | mV | 2.048-V and 2.5-V options, IL = 1 mA, TA = 25°C | 5 | |
| Dropout voltage | VIN-VREF | 45 | mV | 2.048-V and 2.5-V options, IL = 1 mA, 0°C ≤ TA ≤ 70°C | 5 | ||
| Dropout voltage | VIN-VREF | 160 | 235 | mV | 2.048-V and 2.5-V options, IL = 8 mA, TA = 25°C | 5 | |
| Dropout voltage | VIN-VREF | 400 | mV | 2.048-V and 2.5-V options, IL = 8 mA, 0°C ≤ TA ≤ 70°C | 5 | ||
| Supply current (on) | IS(ON) | 230 | 320 | µA | All other voltage options, ILOAD = 0 mA, TA = 25°C | 5 | |
| Supply current (on) | IS(ON) | 375 | µA | All other voltage options, ILOAD = 0 mA, 0°C ≤ TA ≤ 70°C | 5 | ||
| Supply current (off) | IS(OFF) | 0.01 | µA | VEnable < 0.4 V, TA = 25°C | 5 | ||
| Supply current (off) | IS(OFF) | 1 | µA | VEnable < 0.4 V, 0°C ≤ TA ≤ 70°C | 5 | ||
| Logic high input voltage | VH | 0.8 | V | 0°C ≤ TA ≤ 70°C, printed as 0.8 × VIN | 5 | ||
| Logic high input current | IH | 2 | nA | 5 | |||
| Logic low input voltage | VL | 0.4 | V | 0°C ≤ TA ≤ 70°C | 5 | ||
| Logic low input current | IL | 1 | nA | 5 | |||
| Short-circuit current | ISC | 8.5 | 20 | 35 | mA | TA = 25°C | 5 |
| Short-circuit current | ISC | 40 | mA | 0°C ≤ TA ≤ 70°C | 5 | ||
| Maximum voltage on any input pin | -0.3 | 5.6 | V | 4 | |||
| Power dissipation | 345 | mW | TA = 25°C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Ambient temperature | 0 | 70 | °C | Operating free-air temperature range | 4 | ||
| Junction temperature | 0 | 80 | °C | 4 | |||
| Junction-to-ambient thermal resistance | RθJA | 119.3 | °C/W | D (SOIC) 8-pin package | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 52.3 | °C/W | D (SOIC) 8-pin package | 4 | ||
| Junction-to-board thermal resistance | RθJB | 60.3 | °C/W | D (SOIC) 8-pin package | 4 | ||
| Junction-to-top characterization parameter | ψJT | 14.5 | °C/W | D (SOIC) 8-pin package | 4 | ||
| Junction-to-board characterization parameter | ψJB | 59.7 | °C/W | D (SOIC) 8-pin package | 4 |
CAD (KiCad official)
- Symbol:
LM4140BCM-2.5 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
lm4140bcm-2-5-etched.step/lm4140bcm-2-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm4140bcm-2-5.step/lm4140bcm-2-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (33 pp, sha256
18565fb048b1515d, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).