component
LM4051BEM3-1.2
Public Made by Adomby adom
Texas Instruments Voltage Reference, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM4051BEM3-1.2
Texas Instruments · Voltage Reference · SOT-23-3
LM4051BEM3-1.2 from Texas Instruments, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | bidirectional | Parallel current/voltage input of the shunt reference, with an operating reverse current of 0.06 mA to 12 mA and an absolute maximum reverse current of 20 mA. |
| 2 | Anode | output | Common pin, normally grounded, which the datasheet lists as type O and which is connected to the internal die on the SOT-23 package. |
| 3 | NC | unconnected | Not connected on the 1.2V version; it must be left floating or connected to the anode (pin 2), and tying it to the anode is recommended in high-EMI environments. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage tolerance (B grade, 25°C) | VR | -2.4 | 2.4 | mV | IR = 100μA | 5 | |
| Reverse breakdown voltage tolerance (extended range) | VR | -8.6 | 8.6 | mV | IR = 100μA, TA = TJ = TMIN to TMAX (extended range) | 5 | |
| Minimum operating current (extended range) | IRMIN | 70 | µA | TA = TJ = TMIN to TMAX (extended range) | 5 | ||
| Minimum operating current (25°C) | IRMIN | 39 | µA | TJ = 25°C | 5 | ||
| Reverse breakdown voltage change with operating current | ΔVR/ΔIR | 0.3 | mV | IRMIN ≤ IR ≤ 1mA, TJ = 25°C | 5 | ||
| Reverse breakdown voltage change with operating current (extended range) | ΔVR/ΔIR | 1.5 | mV | IRMIN ≤ IR ≤ 1mA, TA = TJ = TMIN to TMAX (extended range) | 5 | ||
| Reverse breakdown voltage change with operating current (1mA to 12mA) | ΔVR/ΔIR | 1.8 | mV | 1mA ≤ IR ≤ 12mA, TJ = 25°C | 5 | ||
| Reverse breakdown voltage change with operating current (1mA to 12mA, extended range) | ΔVR/ΔIR | 8 | mV | 1mA ≤ IR ≤ 12mA, TA = TJ = TMIN to TMAX (extended range) | 5 | ||
| Average reverse breakdown voltage temperature coefficient (over temperature) | ΔVR/ΔT | -50 | 50 | ppm/°C | IR = 100μA, ΔT = −40°C to 125°C, TA = TJ = TMIN to TMAX | 5 | |
| Average reverse breakdown voltage temperature coefficient (25°C) | ΔVR/ΔT | -15 | 15 | ppm/°C | IR = 100μA, ΔT = −40°C to 125°C, TJ = 25°C | 5 | |
| Average reverse breakdown voltage temperature coefficient (IR = 1mA) | ΔVR/ΔT | -15 | 15 | ppm/°C | IR = 1mA | 5 | |
| Average reverse breakdown voltage temperature coefficient (IR = 10mA) | ΔVR/ΔT | -20 | 20 | ppm/°C | IR = 10mA | 5 | |
| Recommended reverse current | 0.06 | 12 | mA | LM4051-1.2 | 4 | ||
| Reverse current | 20 | mA | 4 | ||||
| Forward current | 10 | mA | 4 | ||||
| Power dissipation | 280 | mW | TA = 25°C, M3 package | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Lead temperature, vapor phase | 215 | °C | M3 package, vapor phase (60 s) | 4 | |||
| Lead temperature, infrared | 220 | °C | M3 package, infrared (15 s) | 4 | |||
| ESD human body model | V(ESD) | -2000 | 2000 | V | HBM, ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD charged device model | V(ESD) | -500 | 500 | V | CDM, JEDEC JESD22-C101 | 4 | |
| Operating temperature (extended range) | -40 | 125 | °C | Extended temperature range, Tmin ≤ TA ≤ Tmax | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 214.7 | °C/W | DBZ 3-pin package | 5 | ||
| Typical thermal resistance, board mounted | θJA | 280 | °C/W | SOT-23 package, board mounted (absolute maximum note) | 4 | ||
| Dynamic impedance | ZR | 0.5 | Ω | IR = 1mA, f = 120Hz | 5 | ||
| Wideband noise | eN | 20 | μVrms | IR = 100μA, 10Hz ≤ f ≤ 10kHz | 5 | ||
| Long-term stability of reverse breakdown voltage | ΔVR | 120 | ppm | t = 1000 hrs, T = 25°C ± 0.1°C, IR = 100μA | 6 | ||
| Thermal hysteresis | VHYST | 0.36 | mV/V | ΔT = −40°C to 125°C | 6 | ||
| Reverse breakdown voltage | VR | 1.225 | V | IR = 100μA | 5 |
CAD (KiCad official)
- Symbol:
LM4051BEM3-1.2 - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
lm4051bem3-1-2-etched.step/lm4051bem3-1-2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm4051bem3-1-2.step/lm4051bem3-1-2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (32 pp, sha256
ad122b04920e5f31, retrieved 2026-11-05, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).