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LM4041DYM3-1.2-TR

Public Made by Adom

by adom

Microchip Tech Voltage References, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LM4041DYM3-1.2-TR

Microchip Tech · Voltage References · SOT-23

LM4041DYM3-1.2-TR from Microchip Tech, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 + passive Cathode; connect to positive voltage.
2 , passive Anode; connect to negative voltage (GND).
3 NC unconnected Not internally connected; must be left floating or connected to - (pin 2) because of a parasitic Schottky diode to the die attach.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOT-23
Category Power Supply Chip
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse-Breakdown Voltage Tolerance (25°C) -12 12 mV IR = 100 µA, TA = +25°C 10
Reverse-Breakdown Voltage Tolerance (over temp) -24 24 mV IR = 100 µA 10
Minimum Operating Current IRMIN 45 65 µA TA = +25°C 10
Minimum Operating Current (over temp) IRMIN 70 µA 10
Average Reverse-Breakdown Voltage Temperature Coefficient ∆VR/∆T -150 15 150 ppm/°C IR = 1 mA 10
Reverse-Breakdown Voltage Change with Operating Current Change ∆VR/∆IR 0.7 2 mV IRMIN ≤ IR ≤ 1 mA, TA = +25°C 11
Reverse-Breakdown Voltage Change with Operating Current Change ∆VR/∆IR 2.5 mV IRMIN ≤ IR ≤ 1 mA 11
Reverse-Breakdown Voltage Change with Operating Current Change ∆VR/∆IR 2.5 8 mV 1 mA ≤ IR ≤ 12 mA, TA = +25°C 11
Reverse-Breakdown Voltage Change with Operating Current Change ∆VR/∆IR 10 mV 1 mA ≤ IR ≤ 12 mA 11
Reverse Dynamic Impedance ZR 0.5 2 Ω IR = 1 mA, f = 120 Hz, IAC = 0.1 IR, TA = +25°C 11
Operating Temperature Range TA -40 85 °C 15
Storage Temperature TS -65 150 °C 15
Lead Temperature (vapor phase) 215 °C Vapor phase, 60s 15
Lead Temperature (infrared) 220 °C Infrared, 15s 15
Reverse Current 20 mA 3
Forward Current 10 mA 3
ESD Susceptibility (HBM) 2 kV Note 2 3
ESD Susceptibility (MM) 200 V Note 2 3
Maximum Junction Temperature TJMAX 125 °C 3
Package Thermal Resistance 3-Pin SOT-23 ΘJA 326 °C/W 15
Reverse-Breakdown Voltage VR 1.225 V IR = 100 µA, TA = +25°C 10
Wideband Noise eN 20 µVRMS IR = 100 µA, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz 11
Reverse-Breakdown Voltage Long-Term Stability ∆VR 120 ppm t = 1000 hrs., TA = +25°C ±0.1°C, IR = 100 µA 11
Average Reverse-Breakdown Voltage Temperature Coefficient ∆VR/∆T 20 ppm/°C IR = 10 mA, TA = +25°C 10
Average Reverse-Breakdown Voltage Temperature Coefficient ∆VR/∆T 15 ppm/°C IR = 100 µA, TA = +25°C 10

CAD (KiCad official)

  • Symbol: LM4041DYM3-1.2-TR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lm4041dym3-1-2-tr-etched.step / lm4041dym3-1-2-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm4041dym3-1-2-tr.step / lm4041dym3-1-2-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (30 pp, sha256 a1a806c6cb906720, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF