# LM4040DIM3X-3.0

**Texas Instruments** · Voltage Reference · SOT-23-3

LM4040DIM3X-3.0 from Texas Instruments, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | bidirectional | Parallel current/output voltage pin; an external series resistor from the input supply to the cathode sets the reverse current IR, which must stay between IRMIN and 15 mA. |
| 2 | Anode | output | Anode pin, normally grounded, which the datasheet describes as the reference's return path for the shunted current. |
| 3 | * | unconnected | Must be left floating or connected to pin 2 (anode); TI recommends connecting it to the anode where there is high EMI or significant high-frequency switching noise. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage tolerance, 25°C |  | -30 |  | 30 | mV | IR = 100μA, TA = TJ = 25°C | 19 |
| Reverse breakdown voltage tolerance, TMIN to TMAX |  | -59 |  | 59 | mV | IR = 100μA, TA = TJ = TMIN to TMAX | 19 |
| Minimum operating current, 25°C | IRMIN |  | 45 | 65 | μA | TA = TJ = 25°C | 19 |
| Minimum operating current, TMIN to TMAX | IRMIN |  |  | 70 | μA | TA = TJ = TMIN to TMAX | 19 |
| Average reverse breakdown voltage temperature coefficient | ΔVR/ΔT | -20 |  | 20 | ppm/°C | IR = 10mA | 19 |
| Average reverse breakdown voltage temperature coefficient, 25°C | ΔVR/ΔT | -15 |  | 15 | ppm/°C | IR = 1mA, TA = TJ = 25°C | 19 |
| Average reverse breakdown voltage temperature coefficient, TMIN to TMAX | ΔVR/ΔT | -150 |  | 150 | ppm/°C | IR = 1mA, TA = TJ = TMIN to TMAX | 19 |
| Average reverse breakdown voltage temperature coefficient | ΔVR/ΔT | -15 |  | 15 | ppm/°C | IR = 100μA | 19 |
| Reverse breakdown voltage change with operating current, 25°C | ΔVR/ΔIR |  | 0.4 | 1.1 | mV | IRMIN ≤ IR ≤ 1mA, TA = TJ = 25°C | 19 |
| Reverse breakdown voltage change with operating current, TMIN to TMAX | ΔVR/ΔIR |  |  | 1.3 | mV | IRMIN ≤ IR ≤ 1mA, TA = TJ = TMIN to TMAX | 19 |
| Reverse breakdown voltage change with operating current, 25°C | ΔVR/ΔIR |  | 2.7 | 8 | mV | 1mA ≤ IR ≤ 15mA, TA = TJ = 25°C | 19 |
| Reverse breakdown voltage change with operating current, TMIN to TMAX | ΔVR/ΔIR |  |  | 11 | mV | 1mA ≤ IR ≤ 15mA, TA = TJ = TMIN to TMAX | 19 |
| Reverse dynamic impedance | ZR |  | 0.4 | 1.2 | Ω | IR = 1mA, f = 120Hz, IAC = 0.1 IR | 19 |
| Reverse current, LM4040-N-3.0 (recommended) | IR | 62 |  | 15 | μA to mA |  | 6 |
| Operating temperature, industrial | TA | -40 |  | 85 | °C | Industrial temperature range | 6 |
| Operating temperature | TA | -40 |  | 125 | °C | Operating temperature range | 6 |
| Reverse current | IR |  |  | 20 | mA |  | 5 |
| Forward current | IF |  |  | 10 | mA |  | 5 |
| Power dissipation, SOT-23 (M3) | PD |  |  | 306 | mW | TA = 25°C | 5 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 5 |
| Junction-to-ambient thermal resistance, SOT-23 | RθJA |  | 291.9 |  | °C/W | DBZ (SOT-23) package | 6 |
| Junction-to-case (top) thermal resistance, SOT-23 | RθJC(top) |  | 114.3 |  | °C/W | DBZ (SOT-23) package | 6 |
| Junction-to-board thermal resistance, SOT-23 | RθJB |  | 62.3 |  | °C/W | DBZ (SOT-23) package | 6 |
| Junction-to-top characterization parameter, SOT-23 | ψJT |  | 7.4 |  | °C/W | DBZ (SOT-23) package | 6 |
| Junction-to-board characterization parameter, SOT-23 | ψJB |  | 61 |  | °C/W | DBZ (SOT-23) package | 6 |
| Reverse breakdown voltage | VR |  | 3 |  | V | IR = 100μA | 19 |
| Wideband noise | eN |  | 35 |  | μVrms | IR = 100μA, 10Hz ≤ f ≤ 10kHz | 19 |
| Reverse breakdown voltage long-term stability | ΔVR |  | 120 |  | ppm | t = 1000h, T = 25°C ±0.1°C, IR = 100μA | 19 |
| Thermal hysteresis | VHYST |  | 0.08 |  | % | ΔT = -40°C to 125°C | 20 |

## CAD (KiCad official)

- Symbol: `LM4040DIM3X-3.0`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `lm4040dim3x-3-0-etched.step` / `lm4040dim3x-3-0-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm4040dim3x-3-0.step` / `lm4040dim3x-3-0.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm4040-n) (84 pp, sha256 `fc3ca7d9c21dc51e`, retrieved 2026-11-06, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm4040dim3x-3-0-datasheet.pdf)