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LM397DBVRG

Public Made by Adom

by adom

HANSCHIP semiconductor Comparators, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LM397DBVRG

HANSCHIP semiconductor · Comparators · SOT-23-5

LM397DBVRG from HANSCHIP semiconductor, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN- power_in Inverting comparator input; the input common-mode range is 0 V to VS - 1.5 V at 25°C (0 V to VS - 2 V over the temperature extremes).
2 GND power_in Ground reference pin for the comparator.
3 VIN+ power_in Noninverting comparator input; the input common-mode range is 0 V to VS - 1.5 V at 25°C (0 V to VS - 2 V over the temperature extremes).
4 OUTPUT output Open-collector grounded-emitter NPN output that needs an external pullup resistor to the logic supply and can sink approximately 10 mA.
5 VS power_in Positive supply pin; recommended supply voltage is 5 V to 30 V (single or split supplies).

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-5
Category Amplifiers/Comparators
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VS 5 30 V 3
Operating temperature (free-air) -40 85 °C 3
Supply voltages -15 30 V 3
VIN differential 30 V 3
Voltage at input pins -0.3 30 V 3
Junction temperature 150 °C 3
Soldering, infrared or convection 235 °C 20 sec 3
Soldering, wave 245 °C 10 sec 3
Storage temperature Tstg -65 150 °C 3
Electrostatic discharge, human body model V(ESD) -2000 2000 V HBM, per ANSI/ESDA/JEDEC JS-001 3
Electrostatic discharge, machine model V(ESD) -200 200 V Machine model, per JESD22-A115-A 3
Input offset voltage VOS 2 7 mV VS = 5 V to 30 V, VO = 1.4 V, VCM = 0 V; TA = 25ºC 4
Input offset voltage VOS 10 mV VS = 5 V to 30 V, VO = 1.4 V, VCM = 0 V; at the temperature extremes 4
Input offset current IOS 1.6 50 nA VO = 1.4 V, VCM = 0 V; TA = 25ºC 4
Input offset current IOS 250 nA VO = 1.4 V, VCM = 0 V; at the temperature extremes 4
Input bias current IB 10 250 nA VO = 1.4 V, VCM = 0 V; TA = 25ºC 4
Input bias current IB 400 nA VO = 1.4 V, VCM = 0 V; at the temperature extremes 4
Supply current IS 0.25 0.7 mA RL = open, VS = 5 V 4
Supply current IS 0.3 2 mA RL = open, VS = 30 V 4
Output sink current IO 6 13 mA VIN+ = 1 V, VIN− = 0 V, VO = 1.5 V 4
Output voltage low VOL 180 400 mV IO = −4 mA, VIN+ = 0 V, VIN− = 1 V; TA = 25ºC 4
Output voltage low VOL 700 mV IO = −4 mA, VIN+ = 0 V, VIN− = 1 V; at the temperature extremes 4
Common-mode input voltage range VCM 0 V VS = 5 V to 30 V; TA = 25ºC 4
Output leakage current ILEAKAGE 0.1 nA VIN+ = 1 V, VIN− = 0 V, VO = 5 V 4
Output leakage current ILEAKAGE 1 µA VIN+ = 1 V, VIN− = 0 V, VO = 30 V 4
Voltage gain AV 120 V/mV VS = 15 V, VO = 1.4 V to 11.4 V, RL >= 15 kΩ connected to VS 4
Propagation delay (high to low) tPHL 900 ns Input overdrive = 5 mV; RL = 5.1 kΩ connected to 5 V, CL = 15 pF 4
Propagation delay (high to low) tPHL 250 ns Input overdrive = 50 mV; RL = 5.1 kΩ connected to 5 V, CL = 15 pF 4
Propagation delay (low to high) tPLH 940 µs Input overdrive = 5 mV; RL = 5.1 kΩ connected to 5 V, CL = 15 pF 4
Propagation delay (low to high) tPLH 440 ns Input overdrive = 50 mV; RL = 5.1 kΩ connected to 5 V, CL = 15 pF 4
Junction-to-ambient thermal resistance RθJA 186 °C/W DBV (SOT-23), 5 pins; packages soldered directly onto a PCB 4
Junction-to-case (top) thermal resistance RθJC(top) 92.8 °C/W DBV (SOT-23), 5 pins 4
Junction-to-board thermal resistance RθJB 38.9 °C/W DBV (SOT-23), 5 pins 4
Junction-to-top characterization parameter ψJT 5.6 °C/W DBV (SOT-23), 5 pins 4
Junction-to-board characterization parameter ψJB 38.4 °C/W DBV (SOT-23), 5 pins 4

CAD (KiCad official)

  • Symbol: LM397DBVRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: lm397dbvrg-etched.step / lm397dbvrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm397dbvrg.step / lm397dbvrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (12 pp, sha256 89077a72182b029e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF