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LM336D-2.5RG
Public Made by Adomby adom
HANSCHIP semiconductor Voltage Reference, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LM336D-2.5RG
HANSCHIP semiconductor · Voltage Reference · SOP-8
LM336D-2.5RG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection internally. |
| 2 | NC | unconnected | No connection internally. |
| 3 | NC | unconnected | No connection internally. |
| 4 | V- | power_in | Reference diode anode (negative terminal, ground side); the reference operates over 400µA to 10 mA reverse current. |
| 5 | ADJ | passive | Adjustment pin for trimming the reference breakdown voltage and temperature coefficient, e.g. via a 10kΩ potentiometer. |
| 6 | NC | unconnected | No connection internally. |
| 7 | NC | unconnected | No connection internally. |
| 8 | V+ | power_in | Reference diode cathode (positive terminal) providing the 2.5V reference with reverse current of 400µA to 10 mA (15 mA absolute max reverse current). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reference Breakdown Voltage | VR | 2.44 | 2.49 | 2.54 | V | Tamb = +25°C, IR = 1mA | 3 |
| Reverse Breakdown Voltage Change with Current (Tamb = +25°C) | VR | 2.6 | 3 | mV | 400µA ≤ IR ≤ 10mA, Tamb = +25°C | 3 | |
| Reverse Breakdown Voltage Change with Current (Tmin ≤ Tamb ≤ Tmax) | VR | 10 | 12 | mV | 400µA ≤ IR ≤ 10mA, Tmin ≤ Tamb ≤ Tmax | 3 | |
| Reverse Dynamic Impedance (Tamb = +25°C) | ZD | 0.2 | 0.4 | Ω | IR = 1mA, Tamb = +25°C | 3 | |
| Reverse Dynamic Impedance (Tmin ≤ Tamb ≤ Tmax) | ZD | 1 | 1.4 | Ω | IR = 1mA, Tmin ≤ Tamb ≤ Tmax | 3 | |
| Temperature Stability | KVT | 1.8 | 6 | mV | VR = 2.49V, IR = 1mA | 3 | |
| Long Term Stability | KVH | 20 | ppm | Tamb = +25°C ±0.1°C, IR = 1mA | 3 | ||
| Reverse Current | IRIF | 15 | mA | Reverse | 3 | ||
| Forward Current | IRIF | 10 | mA | Forward | 3 | ||
| Storage Temperature Range | TStg | -65 | 150 | °C | 3 | ||
| Lead Temperature | TL | 245 | °C | Soldering, 10 seconds | 3 | ||
| Operating Free-air Temperature Range (LM336-2.5) | Toper | 0 | 70 | °C | LM336-2.5 | 3 | |
| Operating Current (minimum) | IR | 400 | µA | Wide operating current range (Features) | 1 | ||
| Operating Current (maximum) | IR | 10 | mA | Wide operating current range (Features) | 1 |
CAD (KiCad official)
- Symbol:
LM336D-2.5RG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
lm336d-2-5rg-etched.step/lm336d-2-5rg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm336d-2-5rg.step/lm336d-2-5rg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (12 pp, sha256
0c924d8c297c794e, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LM336D-2.5RG
**HANSCHIP semiconductor** · Voltage Reference · SOP-8
LM336D-2.5RG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection internally. |
| 2 | NC | unconnected | No connection internally. |
| 3 | NC | unconnected | No connection internally. |
| 4 | V- | power_in | Reference diode anode (negative terminal, ground side); the reference operates over 400µA to 10 mA reverse current. |
| 5 | ADJ | passive | Adjustment pin for trimming the reference breakdown voltage and temperature coefficient, e.g. via a 10kΩ potentiometer. |
| 6 | NC | unconnected | No connection internally. |
| 7 | NC | unconnected | No connection internally. |
| 8 | V+ | power_in | Reference diode cathode (positive terminal) providing the 2.5V reference with reverse current of 400µA to 10 mA (15 mA absolute max reverse current). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reference Breakdown Voltage | VR | 2.44 | 2.49 | 2.54 | V | Tamb = +25°C, IR = 1mA | 3 |
| Reverse Breakdown Voltage Change with Current (Tamb = +25°C) | VR | | 2.6 | 3 | mV | 400µA ≤ IR ≤ 10mA, Tamb = +25°C | 3 |
| Reverse Breakdown Voltage Change with Current (Tmin ≤ Tamb ≤ Tmax) | VR | | 10 | 12 | mV | 400µA ≤ IR ≤ 10mA, Tmin ≤ Tamb ≤ Tmax | 3 |
| Reverse Dynamic Impedance (Tamb = +25°C) | ZD | | 0.2 | 0.4 | Ω | IR = 1mA, Tamb = +25°C | 3 |
| Reverse Dynamic Impedance (Tmin ≤ Tamb ≤ Tmax) | ZD | | 1 | 1.4 | Ω | IR = 1mA, Tmin ≤ Tamb ≤ Tmax | 3 |
| Temperature Stability | KVT | | 1.8 | 6 | mV | VR = 2.49V, IR = 1mA | 3 |
| Long Term Stability | KVH | | 20 | | ppm | Tamb = +25°C ±0.1°C, IR = 1mA | 3 |
| Reverse Current | IRIF | | | 15 | mA | Reverse | 3 |
| Forward Current | IRIF | | | 10 | mA | Forward | 3 |
| Storage Temperature Range | TStg | -65 | | 150 | °C | | 3 |
| Lead Temperature | TL | | | 245 | °C | Soldering, 10 seconds | 3 |
| Operating Free-air Temperature Range (LM336-2.5) | Toper | 0 | | 70 | °C | LM336-2.5 | 3 |
| Operating Current (minimum) | IR | 400 | | | µA | Wide operating current range (Features) | 1 |
| Operating Current (maximum) | IR | | | 10 | mA | Wide operating current range (Features) | 1 |
## CAD (KiCad official)
- Symbol: `LM336D-2.5RG`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `lm336d-2-5rg-etched.step` / `lm336d-2-5rg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm336d-2-5rg.step` / `lm336d-2-5rg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HANSCHIP semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757726533102243840) (12 pp, sha256 `0c924d8c297c794e`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lm336d-2-5rg-datasheet.pdf)