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LM324BAIDR

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Texas Instruments Operational Amplifier, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LM324BAIDR

Texas Instruments · Operational Amplifier · SOIC-14

LM324BAIDR from Texas Instruments, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OUT output Output of amplifier 1.
2 1IN- input Negative (inverting) input of amplifier 1.
3 1IN+ input Positive (non-inverting) input of amplifier 1.
4 VCC+ power_in Positive (highest) supply; the B and BA versions support a 3V to 36V supply range.
5 2IN+ input Positive (non-inverting) input of amplifier 2.
6 2IN- input Negative (inverting) input of amplifier 2.
7 2OUT output Output of amplifier 2.
8 3OUT output Output of amplifier 3.
9 3IN- input Negative (inverting) input of amplifier 3.
10 3IN+ input Positive (non-inverting) input of amplifier 3.
11 VCC- power_in Negative (lowest) supply or ground; used as ground for single-supply operation.
12 4IN+ input Positive (non-inverting) input of amplifier 4.
13 4IN- input Negative (inverting) input of amplifier 4.
14 4OUT output Output of amplifier 4.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-14
Category Amplifiers/Comparators
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input offset voltage (25°C) VOS -2 0.3 2 mV LM324BA; VS = 5V to 36V; TA = 25°C 7
Input offset voltage (over temperature) VOS 2.5 mV LM324BA; TA = -40°C to +85°C 7
Power supply rejection ratio PSRR 65 100 dB Input offset voltage versus power supply 7
Common-mode rejection ratio CMRR 70 80 dB VS = 3V to 36V, (V-) ≤ VCM ≤ (V+), 1.5V 7
Common-mode rejection ratio (over temperature) CMRR 65 80 dB VS = 5V to 36V, (V-) ≤ VCM ≤ (V+), 2V, TA = -40°C to +85°C 7
Input bias current IB -10 -35 nA 7
Input bias current (over temperature) IB -60 nA TA = -40°C to +85°C 7
Input offset current IOS -4 0.5 4 nA 7
Input offset current (over temperature) IOS -5 5 nA TA = -40°C to +85°C 7
Open-loop voltage gain AOL 50 100 V/mV VS = 15V, VO = 1V to 11V, RL ≥ 10kΩ connected to (V-) 7
Open-loop voltage gain (over temperature) AOL 25 V/mV TA = -40°C to +85°C 7
Voltage output swing from positive rail VO 1.35 1.5 V Positive rail (V+), IOUT = -50µA 8
Voltage output swing from positive rail VO 1.4 1.6 V Positive rail (V+), IOUT = -1mA 8
Voltage output swing from positive rail VO 1.5 1.75 V Positive rail (V+), IOUT = -5mA 8
Voltage output swing from negative rail VO 100 150 mV Negative rail (V-), IOUT = 50µA 8
Voltage output swing from negative rail VO 0.75 1 V Negative rail (V-), IOUT = 1mA 8
Voltage output swing from negative rail VO 5 20 mV VS = 5V, RL ≤ 10kΩ connected to (V-), TA = -40°C to +85°C 8
Output source current IO -20 -30 mA Source, VS = 15V, VO = V-, VID = 1V 8
Output source current (over temperature) IO -10 mA TA = -40°C to +85°C 8
Output sink current IO 10 20 mA Sink, VS = 15V, VO = V+, VID = -1V 8
Output sink current (over temperature) IO 5 mA TA = -40°C to +85°C 8
Output sink current (low VO) IO 50 85 µA VID = -1V, VO = (V-) + 200mV 8
Short-circuit current ISC -60 40 60 mA VS = 20V, (V+) = 10V, (V-) = -10V, VO = 0V 8
Quiescent current per amplifier IQ 240 300 µA VS = 5V, IO = 0A, TA = -40°C to +85°C 8
Quiescent current per amplifier IQ 350 750 µA VS = 36V, IO = 0A, TA = -40°C to +85°C 8
Supply voltage VCC 3 36 V LM324B, LM324BA 6
Common-mode voltage VCM 0 V Maximum is VCC, 2 V (expression, not numeric) 6
Operating free-air temperature TA -40 85 °C LM324Bx (LM324B, LM324BA) 6
Supply voltage VCC 40 V LM324B, LM324BA 5
Differential input voltage VID -40 40 V LM324B, LM324BA; voltages are at IN+ with respect to IN- 5
Input voltage (either input) VI -0.3 40 V LM324B, LM324BA 5
Operating virtual junction temperature TJ 150 °C 5
Storage temperature Tstg -65 150 °C 5
Junction-to-ambient thermal resistance RθJA 99.3 °C/W D (SOIC) package, 14 pins 6
Junction-to-case (top) thermal resistance RθJC(top) 60.4 °C/W D (SOIC) package, 14 pins 6
Junction-to-board thermal resistance RθJB 57.5 °C/W D (SOIC) package, 14 pins 6
Junction-to-top characterization parameter ψJT 19.8 °C/W D (SOIC) package, 14 pins 6
Junction-to-board characterization parameter ψJB 57 °C/W D (SOIC) package, 14 pins 6

CAD (KiCad official)

  • Symbol: LM324BAIDR
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: lm324baidr-etched.step / lm324baidr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm324baidr.step / lm324baidr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (65 pp, sha256 c2e59bbc9546c539, retrieved 2026-10-17, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF