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Contents

README

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LM3103MHX

Texas Instruments · DC-DC Converters · HTSSOP-16-EP

LM3103MHX from Texas Instruments, in a HTSSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply voltage pin to device with nominal input range of 4.5 V to 42 V.
2 VIN power_in Input supply voltage pin to device with nominal input range of 4.5 V to 42 V.
3 SW output Switch node internally connected to source of main MOSFET and drain of synchronous MOSFET; connect to output inductor.
4 SW output Switch node internally connected to source of main MOSFET and drain of synchronous MOSFET; connect to output inductor.
5 BST passive Bootstrap capacitor connection; connect 33 nF capacitor from SW pin and charge through internal diode during main MOSFET off-time.
6 AGND power_in Analog ground reference for all internal circuitry.
7 SS passive Soft-start pin with 70 µA internal current source charging external capacitor larger than 22 nF.
8 NC unconnected No connection; leave unconnected.
9 GND power_in Ground connection; must be connected to AGND pin for normal operation.
10 GND power_in Ground connection; must be connected to AGND pin for normal operation.
11 FB input Feedback input to regulation and over-voltage comparators with 0.6 V regulation setting; connect feedback resistors.
12 EN input Enable input with internal pull-up; connect to voltage higher than 1.6 V to enable device.
13 RON input On-time control input with external resistor from VIN pin to set main MOSFET on-time.
14 VCC power_out Startup regulator output regulated to 6 V nominal; connect capacitor larger than 1 µF between VCC and AGND for stable operation.
15 PGND power_in Power ground connection for synchronous MOSFET source; tie to ground plane.
16 PGND power_in Power ground connection for synchronous MOSFET source; tie to ground plane.
17 EP power_in Exposed pad thermal connection for die attach; connect to ground plane for thermal dissipation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-16-EP
Category Power Supply Chip
Pins 17

CAD (KiCad official)

  • Symbol: LM3103MHX
  • Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-16-EP (KiCad packages3D, STEP)
  • 3D model files: lm3103mhx-etched.step / lm3103mhx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm3103mhx.step / lm3103mhx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 c083cbc1b779ad70, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF