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LM2833ZMYX

Texas Instruments · DC-DC Converters · HVSSOP-10-EP

LM2833ZMYX from Texas Instruments, in a HVSSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VINC power_in Input supply for internal bias and control circuitry, which needs to be locally bypassed to GND.
2 EN input Enable control input where logic high enables operation; it must not be allowed to float or be subjected to voltages greater than VIN + 0.3V.
3 SGND power_in Signal (analog) ground; the bottom resistor of the feedback network should be placed as close as possible to this pin for good load regulation.
4 NC unconnected No user function; connect this pin to GND.
5 FB input Feedback pin, connected to the external resistor divider that sets the output voltage (output range 0.6V to 4.5V).
6 PGND power_in Power ground pin providing the ground return path for the internal driver.
7 SW output Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output.
8 SW output Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output.
9 VIND power_in Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND.
10 VIND power_in Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND.
11 DAP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-10-EP
Category Power Supply Chip
Pins 11

CAD (KiCad official)

  • Symbol: LM2833ZMYX
  • Footprint: Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm
  • 3D model: HVSSOP-10-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lm2833zmyx-etched.step / lm2833zmyx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2833zmyx.step / lm2833zmyx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 bf1870ef3f8a9cb6, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF