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Initial commit: component/lm2833zmyx

Ray ·b6cbc42f1c ·14h ago
2 files changed +264
README.mdadded+47
@@ -0,0 +1,47 @@+# LM2833ZMYX++**Texas Instruments** · DC-DC Converters · HVSSOP-10-EP++LM2833ZMYX from Texas Instruments, in a HVSSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VINC | power_in | Input supply for internal bias and control circuitry, which needs to be locally bypassed to GND. |+| 2 | EN | input | Enable control input where logic high enables operation; it must not be allowed to float or be subjected to voltages greater than VIN + 0.3V. |+| 3 | SGND | power_in | Signal (analog) ground; the bottom resistor of the feedback network should be placed as close as possible to this pin for good load regulation. |+| 4 | NC | unconnected | No user function; connect this pin to GND. |+| 5 | FB | input | Feedback pin, connected to the external resistor divider that sets the output voltage (output range 0.6V to 4.5V). |+| 6 | PGND | power_in | Power ground pin providing the ground return path for the internal driver. |+| 7 | SW | output | Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output. |+| 8 | SW | output | Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output. |+| 9 | VIND | power_in | Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND. |+| 10 | VIND | power_in | Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND. |+| 11 | DAP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | HVSSOP-10-EP |+| Category | Power Supply Chip |+| Pins | 11 |++## CAD (KiCad official)++- Symbol: `LM2833ZMYX`+- Footprint: `Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm`+- 3D model: HVSSOP-10-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)+- 3D model files: `lm2833zmyx-etched.step` / `lm2833zmyx-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm2833zmyx.step` / `lm2833zmyx.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm2833) (32 pp, sha256 `bf1870ef3f8a9cb6`, retrieved 2026-10-08, tier: lcsc)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/lm2833zmyx-datasheet.pdf)
page.jsonadded+217
@@ -0,0 +1,217 @@+{+  "slug": "lm2833zmyx",+  "version": "0.1.0",+  "type": "component",+  "description": "Texas Instruments DC-DC Converters, HVSSOP-10-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "power supply chip",+    "lm2833zmyx",+    "factory-2.0.0",+    "extractor-text"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "lm2833zmyx.kicad_sym",+    "lm2833zmyx.kicad_mod",+    "lm2833zmyx.glb",+    "lm2833zmyx.step",+    "lm2833zmyx.lbr",+    "docs/hero.png",+    "docs/lm2833zmyx-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html",+    "lm2833zmyx-hero.glb",+    "lm2833zmyx-hero.overlay.json"+  ],+  "component": {+    "mpn": "LM2833ZMYX",+    "manufacturer": "Texas Instruments",+    "package": "HVSSOP-10-EP",+    "pin_count": 11,+    "category": "Power Supply Chip",+    "subcategory": "DC-DC Converters",+    "datasheet": "https://www.ti.com/cn/lit/gpn/lm2833",+    "parts": {+      "symbol": "lm2833zmyx.kicad_sym",+      "footprint": "lm2833zmyx.kicad_mod",+      "model_3d": "lm2833zmyx-hero.glb",+      "model_3d_plain": "lm2833zmyx.glb",+      "model_3d_step": "lm2833zmyx-etched.step",+      "model_3d_step_plain": "lm2833zmyx.step",+      "lbr": "lm2833zmyx.lbr"+    },+    "distributor_links": {+      "lcsc": "C2071700"+    },+    "distributor_check": {+      "checked_at": "2026-10-08T15:31:09Z",+      "source": "Component Ocean /api/assign-pns",+      "digikey": {+        "pn": null,+        "status": "no match"+      },+      "mouser": {+        "pn": null,+        "status": "no match"+      }+    },+    "pins": [+      {+        "number": "1",+        "name": "VINC",+        "type": "power_in",+        "description": "Input supply for internal bias and control circuitry, which needs to be locally bypassed to GND."+      },+      {+        "number": "2",+        "name": "EN",+        "type": "input",+        "description": "Enable control input where logic high enables operation; it must not be allowed to float or be subjected to voltages greater than VIN + 0.3V."+      },+      {+        "number": "3",+        "name": "SGND",+        "type": "power_in",+        "description": "Signal (analog) ground; the bottom resistor of the feedback network should be placed as close as possible to this pin for good load regulation."+      },+      {+        "number": "4",+        "name": "NC",+        "type": "unconnected",+        "description": "No user function; connect this pin to GND."+      },+      {+        "number": "5",+        "name": "FB",+        "type": "input",+        "description": "Feedback pin, connected to the external resistor divider that sets the output voltage (output range 0.6V to 4.5V)."+      },+      {+        "number": "6",+        "name": "PGND",+        "type": "power_in",+        "description": "Power ground pin providing the ground return path for the internal driver."+      },+      {+        "number": "7",+        "name": "SW",+        "type": "output",+        "description": "Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output."+      },+      {+        "number": "8",+        "name": "SW",+        "type": "output",+        "description": "Switch pin, connected to the inductor and catch diode; SW pins 7 and 8 are internally tied together as the power switch output."+      },+      {+        "number": "9",+        "name": "VIND",+        "type": "power_in",+        "description": "Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND."+      },+      {+        "number": "10",+        "name": "VIND",+        "type": "power_in",+        "description": "Input supply voltage (3V to 5.5V operating range), bypassed locally from these pins to PGND."+      },+      {+        "number": "11",+        "name": "DAP",+        "type": "passive",+        "description": "Exposed pad (from the footprint; not named in the datasheet pin table)."+      }+    ],+    "provenance": {+      "extractor": "extract_pins 0.3",+      "factory_chain": {+        "factory": "2.0.0",+        "extractor": "extract_pins 0.3",+        "primary_model": "claude-haiku-5-5",+        "primary_mode": "text",+        "consensus_model": "claude-sonnet-5-5",+        "consensus": "agreed",+        "guards": "pin_guards 0.1: passed",+        "guard_notes": [+          "extractor flagged: The exposed die attach pad is printed as DAP, not as a numbered pin, so it is listed with that label; The MSOP-PowerPAD connection diagram text in the extraction is garbled. The pin-number-to-name mappi; SGND and PGND are typed power_in per the ground convention, although the datasheet calls them signal",+          "exposed pad 11 added from the footprint",+          "dropped thermal pad ['EP'] absent from footprint"+        ],+        "pages_sent": 6,+        "cost_usd": 0.0439,+        "at": "2026-10-08T15:30:37"+      },+      "datasheet": {+        "url": "https://www.ti.com/cn/lit/gpn/lm2833",+        "pages": 32,+        "sha256": "bf1870ef3f8a9cb6",+        "source_tier": "lcsc"+      },+      "cad": "KiCad official (CC-BY-SA 4.0)",+      "pins": {+        "total": 11,+        "described": 11,+        "cites_pages": true,+        "refuses_to_fabricate": true+      }+    },+    "viewers": {+      "symbol": "viewers/symbol.html",+      "footprint": "viewers/footprint.html"+    },+    "models_3d": [+      {+        "file": "lm2833zmyx.step",+        "role": "plain",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.91,+          3,+          1+        ],+        "zmin_mm": 0,+        "centre_offset_mm": 0,+        "footprint_binding": "identity",+        "sha256": "da0f6e35873d100edeb9d9e2509ce43e8c842678317a26df911eb682990b97e5",+        "checked": "2026-10-08",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      },+      {+        "file": "lm2833zmyx-etched.step",+        "role": "eda",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.91,+          3,+          1+        ],+        "zmin_mm": 0,+        "centre_offset_mm": 0,+        "footprint_binding": "identity",+        "sha256": "d911682dace37e91b86e4e25dbd5a565f91c640aa6d9f15436df47494b03baf7",+        "checked": "2026-10-08",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      }+    ]+  },+  "visibility": "public",+  "org": "adom",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file