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LM2738YMY

Public Made by Adom

by adom

Texas Instruments AC-DC Controllers & Regulators, MSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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LM2738YMY

Texas Instruments · AC-DC Controllers & Regulators · MSOP-8-EP

LM2738YMY from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOST input Boost voltage that drives the internal NMOS control switch, with a bootstrap capacitor connected between BOOST and SW (boost voltage rated -0.5 V to 30 V absolute max, boost-to-SW 2.5 V to 5.5 V recommended).
2 VIN power_in Supply voltage for the output power stage, requires a bypass capacitor and must be tied to pin 3 at the package (3 V to 20 V recommended).
3 VCC power_in Input supply voltage of the device, requires a bypass capacitor and must be tied to pin 2 at the package (3 V to 20 V recommended).
4 EN input Enable control input where logic high enables operation; do not allow it to float or exceed VIN + 0.3 V.
5 GND power_in Signal and power ground pin, with the bottom resistor of the feedback network placed as close as possible to it.
6 FB input Feedback pin connected to the external resistor divider to set the output voltage (0.8 V reference).
7 GND power_in Signal and power ground pin, with the bottom resistor of the feedback network placed as close as possible to it.
8 SW output Output switch that connects to the inductor, catch diode, and bootstrap capacitor (rated -0.5 V to 20 V recommended).
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Feedback voltage VFB 0.784 0.8 0.816 V VIN = 12 V, VBOOST - VSW = 5 V 5
Switching frequency (LM2738Y) FSW 0.364 0.55 0.676 MHz LM2738Y 5
Feedback input bias current IFB 0.1 100 nA Sink or source 5
Undervoltage lockout VIN rising UVLO 2.7 2.9 V VIN Rising 5
Undervoltage lockout VIN falling UVLO 2 2.3 V VIN Falling 5
Switch ON resistance RDS(ON) 250 500 mΩ VBOOST - VSW = 3 V, Load = 400 mA 5
Switch current limit ICL 2 2.9 A VBOOST - VSW = 3 V, VIN = 3 V 5
Quiescent current switching IQ 1.9 3 mA Switching 5
Quiescent current non-switching IQ 1.9 mA Non-Switching 5
Quiescent current (shutdown) IQ 400 nA VEN = 0 V 5
Feedback voltage line regulation ΔVFB/ΔVIN 0.02 %/V VIN = 3 V to 20 V 5
UVLO hysteresis 0.4 V 5
Maximum duty cycle (LM2738Y) DMAX 95 % LM2738Y, Load = 150 mA 5
Minimum duty cycle (LM2738Y) DMIN 2 % LM2738Y 5
Boost pin current (LM2738Y) IBOOST 2.5 mA LM2738Y (27% Duty Cycle) 5
Shutdown threshold voltage VEN_TH 0.4 V VEN Falling 5
Enable threshold voltage VEN_TH 1.4 V VEN Rising 5
Enable pin current IEN 10 nA Sink / Source 5
Switch leakage ISW 100 nA VIN = 20 V 5
VIN, VCC VIN, VCC -0.5 24 V 4
SW voltage -0.5 24 V 4
Boost voltage -0.5 30 V 4
Boost to SW voltage -0.5 6 V 4
FB voltage -0.5 3 V 4
Junction temperature TJ 150 °C 4
Infrared and convection reflow soldering 220 °C 15 s 4
Wave soldering lead temperature 260 °C 10 s 4
Storage temperature Tstg -65 150 °C 4
ESD HBM V(ESD) -2000 2000 V Human-body model, ANSI/ESDA/JEDEC JS-001 4
VIN, VCC VIN, VCC 3 20 V 4
SW voltage -0.5 20 V 4
Boost voltage -0.5 25.5 V 4
Boost to SW voltage 2.5 5.5 V 4
Junction temperature TJ -40 125 °C 4
Thermal shutdown 165 °C 4
Junction-to-ambient thermal resistance RθJA 50.3 °C/W DGN (MSOP PowerPAD), 8 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 54.2 °C/W DGN (MSOP PowerPAD) 5
Junction-to-board thermal resistance RθJB 31.4 °C/W DGN (MSOP PowerPAD) 5
Junction-to-top characterization parameter ψJT 4.8 °C/W DGN (MSOP PowerPAD) 5
Junction-to-board characterization parameter ψJB 31.2 °C/W DGN (MSOP PowerPAD) 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 4 °C/W DGN (MSOP PowerPAD) 5

CAD (KiCad official)

  • Symbol: LM2738YMY
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: lm2738ymy-etched.step / lm2738ymy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2738ymy.step / lm2738ymy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (40 pp, sha256 035bc40cca3a6951, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF