# LM27342MY

**Texas Instruments** · DC-DC Converters · MSOP-10-EP

LM27342MY from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | output | Output switch that connects to the inductor, catch diode, and bootstrap capacitor. |
| 2 | SW | output | Output switch that connects to the inductor, catch diode, and bootstrap capacitor. |
| 3 | BOOST | input | Boost voltage that drives the internal NMOS control switch; a bootstrap capacitor is connected between BOOST and SW, with Boost to SW recommended at 3 V to 5.5 V. |
| 4 | EN | input | Enable control input where logic high enables operation; do not allow it to float or to be greater than VIN + 0.3 V. |
| 5 | SYNC | input | Frequency synchronization input driven by an external clock or pulse train within 1 MHz < fSW < 2.35 MHz; ground it to use the internal 2 MHz clock. |
| 6 | FB | input | Feedback pin that connects to the external resistor divider to set the output voltage. |
| 7 | GND | power_in | Signal and power ground; place the bottom resistor of the feedback network as close as possible to this pin for accurate regulation. |
| 8 | AVIN | power_in | Supply voltage for the control circuitry, recommended at 3 V to 20 V. |
| 9 | PVIN | power_in | Supply voltage for the output power stage; connect a bypass capacitor to this pin. |
| 10 | PVIN | power_in | Supply voltage for the output power stage; connect a bypass capacitor to this pin. |
| 11 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-10-EP |
| Category | Power Management (PMIC) |
| Pins | 11 |

## CAD (KiCad official)

- Symbol: `LM27342MY`
- Footprint: `Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm`
- 3D model: MSOP-10-EP (KiCad packages3D, STEP)
- 3D model files: `lm27342my-etched.step` / `lm27342my-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm27342my.step` / `lm27342my.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm27342) (55 pp, sha256 `cef0ca904e2ee532`, retrieved 2026-10-11, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm27342my-datasheet.pdf)