component
LM2700MTX-ADJ
Public Made by Adomby adom
Texas Instruments DC-DC Converters, TSSOP-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownLM2700MTX-ADJ
Texas Instruments · DC-DC Converters · TSSOP-14
LM2700MTX-ADJ from Texas Instruments, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VC | passive | Compensation network connection to the output of the voltage error amplifier, where the series RC/CC network is connected to set loop compensation. |
| 2 | FB | input | Output voltage feedback input, regulated to 1.26V nominal and set by a resistor divider from VOUT. |
| 3 | SHDN | input | Active-low shutdown control input; SHDN voltage is rated 7V maximum and should never exceed VIN. |
| 4 | AGND | power_in | Analog ground for the sensitive control circuitry; tied directly to the PGND pins at the package, and the feedback and compensation networks should return to this pin if no analog ground plane is available. |
| 5 | PGND | power_in | Power ground for the driver and NMOS power device; PGND pins must be connected together directly at the part. |
| 6 | PGND | power_in | Power ground for the driver and NMOS power device; PGND pins must be connected together directly at the part. |
| 7 | PGND | power_in | Power ground for the driver and NMOS power device; PGND pins must be connected together directly at the part. |
| 8 | SW | input | Power switch input connected between the SW pins and PGND; SW voltage is rated 18V absolute maximum and 17.5V in operating conditions. |
| 9 | SW | input | Power switch input connected between the SW pins and PGND; SW voltage is rated 18V absolute maximum and 17.5V in operating conditions. |
| 10 | SW | input | Power switch input connected between the SW pins and PGND; SW voltage is rated 18V absolute maximum and 17.5V in operating conditions. |
| 11 | NC | unconnected | Pin not connected internally. |
| 12 | VIN | power_in | Analog power input; supply range is 2.2V to 12V. |
| 13 | FSLCT | input | Switching frequency select input: VIN selects 1.25MHz and ground selects 600kHz; rated 12V maximum and should never exceed VIN. |
| 14 | NC | unconnected | Not internally connected; the datasheet instructs to connect this pin to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | TSSOP-14 |
| Category | Power Management ICs |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VC Voltage | VC | 0.965 | 1.565 | V | 4 | ||
| VIN Voltage | VIN | 12 | V | 4 | |||
| SW Voltage | 18 | V | 4 | ||||
| FB Voltage | 7 | V | 4 | ||||
| SHDN Voltage | 7 | V | 4 | ||||
| FSLCT Voltage | 12 | V | 4 | ||||
| Maximum Junction Temperature | 150 | °C | 4 | ||||
| Lead Temperature | 300 | °C | 4 | ||||
| Vapor Phase Soldering Temperature | 215 | °C | Vapor phase, 60 sec. | 4 | |||
| Infrared Soldering Temperature | 220 | °C | Infrared, 15 sec. | 4 | |||
| ESD Human Body Model | 2 | kV | Human body model | 4 | |||
| ESD Machine Model | 200 | V | Machine model | 4 | |||
| Operating Junction Temperature Range | -40 | 125 | °C | 4 | |||
| Supply Voltage | VIN | 2.2 | 12 | V | 4 | ||
| SW Voltage (operating) | 17.5 | V | 4 | ||||
| Storage Temperature | -65 | 150 | °C | 4 | |||
| Quiescent Current (not switching, FSLCT=0V) | IQ | 1.2 | 2 | mA | FB = 2.2V (Not Switching), FSLCT = 0V | 5 | |
| Quiescent Current (not switching, FSLCT=VIN) | IQ | 1.3 | 2 | mA | FB = 2.2V (Not Switching), FSLCT = VIN | 5 | |
| Quiescent Current (shutdown) | IQ | 5 | 20 | µA | VSHDN = 0V | 5 | |
| Feedback Voltage | VFB | 1.2285 | 1.26 | 1.2915 | V | 5 | |
| Switch Current Limit | ICL | 2.55 | 3.6 | 4.3 | A | VIN = 2.7V (0% duty cycle) | 5 |
| Feedback Voltage Line Regulation | %VFB/ΔVIN | 0.02 | 0.07 | %/V | 2.2V ≤ VIN ≤ 12.0V | 5 | |
| FB Pin Bias Current | IB | 0.5 | 40 | nA | 5 | ||
| Input Voltage Range | VIN | 2.2 | 12 | V | 5 | ||
| Error Amp Transconductance | gm | 40 | 155 | 290 | µmho | ΔI = 5µA | 5 |
| Error Amp Voltage Gain | AV | 135 | V/V | 5 | |||
| Maximum Duty Cycle | DMAX | 78 | 85 | % | FSLCT = Ground | 5 | |
| Minimum Duty Cycle (FSLCT=Ground) | DMIN | 15 | % | FSLCT = Ground | 5 | ||
| Minimum Duty Cycle (FSLCT=VIN) | DMIN | 30 | % | FSLCT = VIN | 5 | ||
| Switching Frequency (FSLCT=Ground) | fS | 480 | 600 | 720 | kHz | FSLCT = Ground | 5 |
| Switching Frequency (FSLCT=VIN) | fS | 1 | 1.25 | 1.5 | MHz | FSLCT = VIN | 5 |
| Shutdown Pin Current (high) | ISHDN | 0.008 | 1 | µA | VSHDN = VIN | 5 | |
| Shutdown Pin Current (low) | ISHDN | -0.5 | -1 | µA | VSHDN = 0V | 5 | |
| Switch Leakage Current | IL | 0.02 | 20 | µA | VSW = 18V | 5 | |
| Switch RDSON | RDSON | 80 | 150 | mΩ | VIN = 2.7V, ISW = 2A | 5 | |
| SHDN Threshold Output High | ThSHDN | 0.9 | V | Output High (second printed value 0.6 not assigned) | 5 | ||
| SHDN Threshold Output Low | ThSHDN | 0.6 | V | Output Low (second printed value 0.3 not assigned) | 5 | ||
| UVP On Threshold | 1.95 | 2.05 | 2.2 | V | 5 | ||
| UVP Off Threshold | 1.85 | 1.95 | 2.1 | V | 5 | ||
| Thermal Resistance Junction-to-Ambient (TSSOP) | θJA | 150 | °C/W | TSSOP, package only | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | capacitor can be placed in parallel with CIN, close to the VIN pin, to shunt any high frequency noise to ground. The output capacitor, COUT, should also be placed close to the IC. Any copper trace con | 14 |
CAD (KiCad official)
- Symbol:
LM2700MTX-ADJ - Footprint:
Package_SO:TSSOP-14_4.4x5mm_P0.65mm - 3D model: TSSOP-14 (KiCad packages3D, STEP)
- 3D model files:
lm2700mtx-adj-etched.step/lm2700mtx-adj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm2700mtx-adj.step/lm2700mtx-adj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
a34db8e9ef23b968, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).