component

LM2676S-3.3

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, TO-263-7. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icslm2676s-3.3factory-2.0.0extractor-text

Verified LM2676S-3.3

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: LM2676S-3.3 · TO-263-7 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 41-page datasheet
  • ✓distributor: lcsc C181465, digikey 296-37723-5-ND, mouser 926-LM2676S-33
  • ✓family: TO-263-7_TabPin8
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-yrwxw04g/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ lm2676s-3-3.kicad_sym✓ lm2676s-3-3.kicad_mod✓ lm2676s-3-3.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 5h ago
viewers lm2676s-3-3: viewers · Ray 5h ago
lm2676s-3-3-etched.glb Publish 0.1.0 · Ray 5h ago
lm2676s-3-3-etched.step lm2676s-3-3: factory component page (tier=mfr) · Ray 5h ago
lm2676s-3-3-hero.glb lm2676s-3-3: hero GLB from the etched model (keeps the MPN mark) · Ray 5h ago
lm2676s-3-3-hero.overlay.json Publish 0.1.0 · Ray 5h ago
lm2676s-3-3.glb Publish 0.1.0 · Ray 5h ago
lm2676s-3-3.kicad_mod Publish 0.1.0 · Ray 5h ago
lm2676s-3-3.kicad_sym Publish 0.1.0 · Ray 5h ago
lm2676s-3-3.lbr Publish 0.1.0 · Ray 5h ago
lm2676s-3-3.step Publish 0.1.0 · Ray 5h ago
package.json Publish 0.1.0 · Ray 5h ago
page.json Set visibility: public · Ray 5h ago
README.md Publish 0.1.0 · Ray 5h ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 5h ago

LM2676S-3.3

Texas Instruments · DC-DC Converters · TO-263-7

LM2676S-3.3 from Texas Instruments, in a TO-263-7. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Switch_output output Source pin of the internal high-side FET and the switching node; connect it to the inductor and the cathode of the external diode.
2 Input input Supply input to the collector of the high-side FET; connect to the power supply and input bypass capacitor CIN, keeping the path to GND as short as possible, with a recommended supply voltage of 8 V to 40 V.
3 CB input Bootstrap capacitor connection for the high-side driver; connect a high-quality 100-nF capacitor from CB to the Switch_output pin.
4 GND power_in Power ground pin; connect to system ground, with the CIN and COUT ground connections kept short.
5 NC unconnected No-connect pin; leave unconnected.
6 FB input Feedback sense input; connect to the feedback divider midpoint to set VOUT for the ADJ version, or connect directly to the output capacitor for fixed-output versions, with an absolute maximum pin voltage of 14 V.
7 ON/OFF input Enable input to the regulator; high or floating enables the regulator and low turns it off.
8 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package TO-263-7
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (over line and load, 25 °C) VOUT 3.234 3.3 3.366 V VIN = 8 V to 40 V, 100 mA ≤ IOUT ≤ 3 A; TA = TJ = 25 °C 5
Output voltage (over temperature) VOUT 3.201 3.3 3.399 V VIN = 8 V to 40 V, 100 mA ≤ IOUT ≤ 3 A; over the entire junction temperature range of operation -40°C to 125°C 5
Quiescent current IQ 4.2 6 mA VFEEDBACK = 8 V for 3.3-V, 5-V, and ADJ versions 6
Standby quiescent current ISTBY 50 100 µA ON/ OFF pin = 0 V 6
Standby quiescent current (over temperature) ISTBY 150 µA over the entire junction temperature range of operation -40°C to 125°C 6
Current limit ICL 3.8 4.5 5.25 A 6
Current limit (over temperature) ICL 3.6 5.4 A over the entire junction temperature range of operation, 40°C to 125°C 6
Output leakage current IL 200 µA VIN = 40 V, soft-start pin = 0 V; VSWITCH = 0 V 6
Switch ON-resistance RDS(ON) 0.15 0.17 Ω ISWITCH = 3 A 6
Switch ON-resistance (over temperature) RDS(ON) 0.29 Ω over the entire junction temperature range of operation -40°C to 125°C 6
Oscillator frequency (over temperature) fO 225 280 kHz over the entire junction temperature range of operation -40°C to 125°C 6
Maximum duty cycle D 91 % 6
Minimum duty cycle D 0 % 6
ON/OFF threshold voltage (over temperature) VON/OFF 0.8 2 V over the entire junction temperature range of operation -40°C to 125°C 6
ON/OFF input current (over temperature) ION/OFF 45 µA over the entire junction temperature range of operation -40°C to 125°C 6
Input supply voltage 45 V 4
Soft-start pin voltage -0.1 6 V 4
Switch voltage to ground -1 V DC voltage; max printed as VIN 4
Feedback pin voltage -0.3 14 V 4
Soldering temperature 260 °C Wave, 4 s 4
Soldering temperature 240 °C Infrared, 10 s 4
Soldering temperature 219 °C Vapor phase, 75 s 4
Storage temperature Tstg -65 150 °C 4
Supply voltage 8 40 V 4
Junction temperature TJ -40 125 °C 4
Junction-to-ambient thermal resistance (KTW, DDPAK 7-pin) RθJA 56 °C/W 7-lead DDPAK mounted horizontally, PCB area 0.136 in² of 1 oz copper (footnote 4) 4
Junction-to-ambient thermal resistance (KTW, DDPAK 7-pin) RθJA 35 °C/W 7-lead DDPAK mounted horizontally, PCB area 0.4896 in² of 1 oz copper (footnote 5) 4
Junction-to-ambient thermal resistance (KTW, DDPAK 7-pin) RθJA 26 °C/W 7-lead DDPAK mounted horizontally, PCB copper area 1.0064 in² of 1 oz copper (footnote 6) 4
Junction-to-case (top) thermal resistance RθJC(top) 2 °C/W 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper (2) Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with 0.5 in leads in a socket, or on a PCB with minimum copper area. 5

CAD (KiCad official)

  • Symbol: LM2676S-3.3
  • Footprint: Package_TO_SOT_SMD:TO-263-7_TabPin8
  • 3D model: TO-263-7 (KiCad packages3D, STEP)
  • 3D model files: lm2676s-3-3-etched.step / lm2676s-3-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2676s-3-3.step / lm2676s-3-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (41 pp, sha256 2f3085e42097cc93, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF