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LM2672M-ADJ

Texas Instruments · DC-DC Converters · SOIC-8

LM2672M-ADJ from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CB passive Boot-strap capacitor connection for the high-side driver; connect a high quality 100-nF capacitor from CB to the VSW pin.
2 SS input Soft-start capacitor pin; connect a capacitor from this pin to GND to control the output voltage ramp, or leave it floating if the feature is not desired.
3 SYNC input Allows control of the switching clock frequency; if left open-circuited the regulator switches at the internal oscillator frequency, typically 260 kHz.
4 FB input Feedback sense input; connect to the midpoint of the feedback divider to set VOUT for the ADJ version.
5 ON/OFF input Enable input to the regulator where high = ON and low = OFF; pull high or float to enable, with ON/OFF pin voltage rated -0.1 V to 6 V.
6 GND power_in Power ground pin to be connected to system ground; the path to CIN must be as short as possible.
7 VIN power_in Supply input pin to the collector of the high-side FET; recommended supply voltage range is 6.5 V to 40 V.
8 VSW output Source pin of the internal high-side FET and switching node that connects to the inductor and the external diode cathode; switch voltage to ground limited to -1 V minimum.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage 45 V 4
ON/OFF pin voltage VSH -0.1 6 V 4
Switch voltage to ground -1 V 4
Boost pin voltage 8 V VSW + 8 V, referenced to VSW pin 4
Feedback pin voltage VFB -0.3 14 V 4
Lead temperature, D package vapor phase 215 °C Vapor phase (60 s) 4
Lead temperature, D package infrared 220 °C Infrared (15 s) 4
Lead temperature, P package 260 °C Soldering, 10 s 4
Maximum junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Supply voltage 6.5 40 V 4
Operating junction temperature TJ -40 125 °C 4
Feedback voltage VFB 1.192 1.21 1.228 V TJ = 25°C; VIN = 8 V to 40 V, ILOAD = 20 mA to 1 A, VOUT programmed for 5 V 6
Feedback voltage VFB 1.174 1.246 V TJ = -40°C to 125°C; VIN = 8 V to 40 V, ILOAD = 20 mA to 1 A, VOUT programmed for 5 V 6
Quiescent current IQ 2.5 3.6 mA VFEEDBACK = 8 V for 3.3 V, 5 V, and adjustable versions 6
Standby quiescent current ISTBY 50 100 μA ON/OFF Pin = 0 V, TJ = 25°C 6
Standby quiescent current ISTBY 150 μA ON/OFF Pin = 0 V, TJ = -40°C to 125°C 6
Current limit ICL 1.25 1.55 2.1 A 6
Current limit ICL 1.2 2.2 A 6
Output leakage current IL 1 25 μA VSWITCH = 0 V, ON/OFF Pin = 0 V, VIN = 40 V 6
Output leakage current IL 6 15 mA VSWITCH = −1 V, ON/OFF Pin = 0 V 6
Switch on-resistance RDS(ON) 0.25 0.3 Ω ISWITCH = 1 A, TJ = 25°C 6
Switch on-resistance RDS(ON) 0.5 Ω ISWITCH = 1 A, TJ = -40°C to 125°C 6
Oscillator frequency fO 260 kHz TJ = 25°C, measured at switch pin 6
Oscillator frequency fO 225 275 kHz Measured at switch pin, TJ = -40°C to 125°C 6
Minimum duty cycle D 0 % TJ = -40°C to 125°C 6
Maximum duty cycle D 95 % TJ = 25°C 6
Feedback bias current IBIAS 85 nA VFEEDBACK = 1.3 V, adjustable version only 6
ON/OFF pin voltage VS/D 1.4 V TJ = 25°C 6
ON/OFF pin voltage VS/D 0.8 2 V TJ = -40°C to 125°C 6
ON/OFF pin current IS/D 20 μA ON/OFF Pin = 0 V, TJ = 25°C 6
ON/OFF pin current IS/D 7 37 μA ON/OFF Pin = 0 V, TJ = -40°C to 125°C 6
Synchronization frequency FSYNC 400 kHz VSYNC = 3.5 V, 50% duty cycle 6
Synchronization threshold voltage VSYNC 1.4 V 6
Soft-start voltage VSS 0.63 V TJ = 25°C 6
Soft-start voltage VSS 0.53 0.73 V TJ = -40°C to 125°C 6
Soft-start current ISS 4.5 μA TJ = 25°C 6
Soft-start current ISS 1.5 6.9 μA TJ = -40°C to 125°C 6
Junction-to-ambient thermal resistance RθJA 105 °C/W D (SOIC) package, 8 pins 4

CAD (KiCad official)

  • Symbol: LM2672M-ADJ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: lm2672m-adj-etched.step / lm2672m-adj-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2672m-adj.step / lm2672m-adj.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 4465557d2db983f5, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF