Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

LM2671MX-ADJ

Texas Instruments · DC-DC Converters · SOIC-8

LM2671MX-ADJ from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CB output Bootstrap capacitor connection for high-side driver; connect a high-quality 100-nF capacitor from CB to VSW pin to boost gate drive above VIN.
2 SS output Soft-start pin; connect a capacitor from this pin to GND to control output voltage ramp rate, or leave floating if soft-start feature not desired.
3 SYNC input Synchronization input for clock frequency control; if left open-circuited, regulator switches at internal oscillator frequency of typically 260 kHz.
4 FB input Feedback sense input pin; connect to midpoint of feedback divider to set VOUT for adjustable version or directly to output capacitor for fixed output version.
5 ON/OFF input Enable input to voltage regulator; high = ON and low = OFF; pull high or float to enable the regulator.
6 GND power_in Power ground pins; connect to system ground and ground pins of input and output capacitors with shortest possible path from CIN.
7 VIN power_in Supply input pin connected to collector of high-side FET; connect to power supply and input bypass capacitors CIN with shortest path for high-frequency bypass.
8 VSW output Source pin of internal high-side FET switching node; attach to inductor and cathode of external diode.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Power Management (PMIC)
Pins 8

CAD (KiCad official)

  • Symbol: LM2671MX-ADJ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: lm2671mx-adj-etched.step / lm2671mx-adj-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2671mx-adj.step / lm2671mx-adj.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (40 pp, sha256 3002d970b17265d0, retrieved 2026-09-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF