component
LM2660M
Public Made by Adomby adom
Texas Instruments DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM2660M
Texas Instruments · DC-DC Converters · SOIC-8
LM2660M from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | FC | input | Frequency control for the internal oscillator: open gives fOSC = 10 kHz (typ), V+ gives 80 kHz (typ); no effect when OSC is driven externally. |
| 2 | CAP+ | passive | Connect to the positive terminal of the charge-pump capacitor. |
| 3 | GND | power_in | Power supply ground input in inverter mode; power supply positive voltage input in doubler mode. |
| 4 | CAP− | passive | Connect to the negative terminal of the charge-pump capacitor. |
| 5 | OUT | power_out | Negative voltage output in inverter mode; power supply ground input in doubler mode. |
| 6 | LV | input | Low-voltage operation input: tie to GND when input is below 3.5 V, GND or open above 3.5 V, must be GND when OSC is driven externally, and must be tied to OUT in doubler mode. |
| 7 | OSC | input | Oscillator control input with an internal 15-pF capacitor; an external capacitor slows the oscillator or an external clock can drive it (not in doubler mode). |
| 8 | V+ | power_in | Power supply positive voltage input in inverter mode; positive voltage output in doubler mode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, Inverter LV=Open | V+ | 3.5 | 5.5 | V | RL = 1k, Inverter, LV = Open | 5 | |
| Supply voltage, Inverter LV=GND | V+ | 1.5 | 5.5 | V | RL = 1k, Inverter, LV = GND | 5 | |
| Supply voltage, Doubler LV=OUT | V+ | 2.5 | 5.5 | V | RL = 1k, Doubler, LV = OUT | 5 | |
| Supply current FC open | IQ | 0.12 | 0.5 | mA | No Load, FC = Open | 5 | |
| Supply current FC=V+ | IQ | 1 | 3 | mA | No Load, FC = V+ | 5 | |
| Output current TA<=85C | IL | 100 | mA | TA ≤ 85°C, OUT ≤ −4 V | 5 | ||
| Output current TA>85C | IL | 100 | mA | TA > 85°C, OUT ≤ −3.8 V | 5 | ||
| Output resistance TA<=85C | ROUT | 6.5 | 10 | Ω | IL = 100 mA, TA ≤ 85°C | 5 | |
| Output resistance TA>85C | ROUT | 12 | Ω | IL = 100 mA, TA > 85°C | 5 | ||
| Oscillator frequency FC open | fOSC | 10 | kHz | FC = Open, OSC = Open | 5 | ||
| Oscillator frequency FC=V+ | fOSC | 80 | kHz | FC = V+, OSC = Open | 5 | ||
| Switching frequency FC open | fSW | 5 | kHz | FC = Open, OSC = Open | 5 | ||
| Switching frequency FC=V+ | fSW | 40 | kHz | FC = V+, OSC = Open | 5 | ||
| OSC input current FC open | IOSC | -2 | 2 | µA | FC = Open | 5 | |
| OSC input current FC=V+ | IOSC | -16 | 16 | µA | FC = V+ | 5 | |
| Power efficiency RL 1k | PEFF | 96 | 98 | % | RL (1k) between V+ and OUT | 5 | |
| Power efficiency RL 500 | PEFF | 92 | 96 | % | RL (500) between GND and OUT | 5 | |
| Power efficiency IL=100 mA | PEFF | 88 | % | IL = 100 mA to GND | 5 | ||
| Voltage conversion efficiency | VOEFF | 99 | 99.96 | % | No Load | 5 | |
| Supply voltage | 6 | V | V+ to GND, or GND to OUT | 4 | |||
| V+ and OUT continuous output current | 120 | mA | 4 | ||||
| Power dissipation SOIC (D) | 735 | mW | SOIC (D) | 4 | |||
| Lead temperature | 300 | °C | soldering, 10 seconds | 4 | |||
| Operating junction temperature | TJ | -40 | 85 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | 2000 | V | HBM, per ANSI/ESDA/JEDEC JS-001, all pins | 4 | ||
| Supply voltage Inverter LV=Open | V+ | 3.5 | 5.5 | V | Inverter, LV = Open | 4 | |
| Supply voltage Inverter LV=GND | V+ | 1.5 | 5.5 | V | Inverter, LV = GND | 4 | |
| Supply voltage Doubler LV=OUT | V+ | 2.5 | 5.5 | V | Doubler, LV = OUT | 4 | |
| Junction temperature | TJ | -40 | 85 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 170 | °C/W | SOIC (D), 8 pins | 4 |
CAD (KiCad official)
- Symbol:
LM2660M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
lm2660m-etched.step/lm2660m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm2660m.step/lm2660m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
57a57bac6fba6b6b, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).