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LM26420XMHX

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Texas Instruments DC-DC Converters, HTSSOP-20-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management icslm26420xmhxfactory-2.0.0extractor-text

Verified LM26420XMHX

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 21 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: LM26420XMHX · HTSSOP-20-EP · 21 pins
  • ✓copper: 21 copper pads, none touching another net
  • ✓datasheet: all 21 pin names found in the 47-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-x4gtkwqx/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 21 pins = 21 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 21 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ lm26420xmhx.kicad_sym✓ lm26420xmhx.kicad_mod✓ lm26420xmhx.step
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Ray Publish 0.1.0 e261fe1 7d ago

LM26420XMHX

Texas Instruments · DC-DC Converters · HTSSOP-20-EP

LM26420XMHX from Texas Instruments, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VINC power_in Input supply for control circuitry.
2 EN1 input Logic high enable operation for Buck 1; do not allow this pin to float or be greater than VIN + 0.3 V.
3 VIND1 power_in Power input supply for Buck 1.
4 VIND1 power_in Power input supply for Buck 1.
5 SW1 output Output switch for Buck 1; connect to the inductor.
6 PGND1 power_in Power ground pin for Buck 1.
7 PGND1 power_in Power ground pin for Buck 1.
8 FB1 input Feedback pin for Buck 1; connect to external resistor divider to set output voltage.
9 PG1 output Power Good indicator for Buck 1; connected through a resistor to an external supply (open drain output).
10 DAP passive Die Attach Pad; connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection.
11 DAP passive Die Attach Pad; connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection.
12 PG2 output Power Good indicator for Buck 2; connected through a resistor to an external supply (open drain output).
13 FB2 input Feedback pin for Buck 2; connect to external resistor divider to set output voltage.
14 PGND2 power_in Power ground pin for Buck 2.
15 PGND2 power_in Power ground pin for Buck 2.
16 SW2 output Output switch for Buck 2; connect to the inductor.
17 VIND2 power_in Power input supply for Buck 2.
18 VIND2 power_in Power input supply for Buck 2.
19 EN2 input Logic high enable operation for Buck 2; do not allow this pin to float or be greater than VIN + 0.3 V.
20 AGND power_in Signal ground pin; place the bottom resistor of the feedback network as close as possible to this pin.
21 DAP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20-EP
Category Power Management ICs
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN VIN -0.5 7 V 6
FB voltage FB -0.5 3 V 6
EN voltage EN -0.5 7 V 6
SW output voltage SW -0.5 7 V 6
Soldering information 220 °C Infrared or convection reflow (15 sec) 6
Storage temperature Tstg -65 150 °C 6
ESD HBM V(ESD) -2000 2000 V Human-body model, ANSI/ESDA/JEDEC JS-001 6
ESD CDM V(ESD) -750 750 V Charged-device model, JESD22-C101 6
Input voltage VIN 3 5.5 V 6
Junction temperature (Q1) TJ -40 125 °C Q1 6
Junction temperature (Q0) TJ -40 150 °C Q0 6
Junction-to-ambient thermal resistance RθJA 38.5 °C/W PWP (HTSSOP) 20 pins 6
Junction-to-case (top) thermal resistance RθJC(top) 21 °C/W PWP (HTSSOP) 20 pins 6
Junction-to-board thermal resistance RθJB 19.9 °C/W PWP (HTSSOP) 20 pins 6
Junction-to-top characterization parameter ψJT 0.7 °C/W PWP (HTSSOP) 20 pins 6
Junction-to-board characterization parameter ψJB 19.7 °C/W PWP (HTSSOP) 20 pins 6
Junction-to-case (bottom) thermal resistance RθJC(bot) 3.5 °C/W PWP (HTSSOP) 20 pins 6
Feedback voltage VFB 0.788 0.8 0.812 V 7
Feedback voltage line regulation ΔVFB/VIN 0.05 %/V VIN = 3 V to 5.5 V 7
Feedback input bias current IB 0.4 100 nA 7
Undervoltage lockout, rising UVLO 2.628 2.9 V VIN Rising 7
Undervoltage lockout, falling UVLO 2 2.3 V VIN Falling 7
UVLO hysteresis UVLO 330 mV 7
Switching frequency FSW 1.85 2.2 2.65 MHz LM26420-X 7
Frequency foldback FFB 300 kHz LM26420-X 7
Maximum duty cycle DMAX 86 91.5 % LM26420-X 7
Top switch on resistance RDSON_TOP 70 135 mΩ HTSSOP-20 Package 7
Bottom switch on resistance RDSON_BOT 45 80 mΩ TSSOP-20 Package 7
Top switch current limit ICL_TOP 2.4 3.3 A VIN = 3.3 V 7
Bottom switch reverse current limit ICL_BOT 0.4 0.75 A VIN = 3.3 V 7
Phase shift between SW1 and SW2 ΔΦ 160 180 200 ° 7
Enable threshold voltage VEN_TH 0.97 1.04 1.12 V 7
Enable threshold hysteresis VEN_TH 0.15 V 7
Switch leakage ISW_TOP -0.7 µA 7
Enable pin current sink/source IEN 5 nA 7
Upper power good threshold VPG-TH-U 848 925 1008 mV FB Pin Voltage Rising 7
Upper power good hysteresis 40 mV 7
Lower power good threshold VPG-TH-L 656 710 791 mV FB Pin Voltage Rising 7
Lower power good hysteresis 40 mV 7
VINC quiescent current (non-switching) IQVINC 3.3 5 mA LM26420X/Y, VFB = 0.9 V, both outputs on 7
VINC quiescent current (switching) IQVINC 4.7 6.2 mA LM26420X/Y, VFB = 0.7 V, both outputs on 7
VINC quiescent current (shutdown) IQVINC 0.05 µA All Options, VEN = 0 V 7
VIND quiescent current (non-switching) IQVIND 0.9 1.5 mA LM26420X/Y, VFB = 0.9 V 7
VIND quiescent current (switching) IQVIND 11 15 mA LM26420X, VFB = 0.7 V 7
VIND quiescent current (shutdown) IQVIND 0.1 µA All Options, VEN = 0 V 7
Thermal shutdown temperature TSD 165 °C 7

CAD (KiCad official)

  • Symbol: LM26420XMHX
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP (KiCad packages3D, STEP)
  • 3D model files: lm26420xmhx-etched.step / lm26420xmhx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm26420xmhx.step / lm26420xmhx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (47 pp, sha256 31980aecd87c6fe7, retrieved 2026-10-31, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF