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LM2575HVMX-5.0

Texas Instruments · DC-DC Converters · SOIC-24-300mil

LM2575HVMX-5.0 from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PWR_GND power_in Power ground return for the internal power switch. Tie to pin 12 and to the input/output capacitor return; use wide, low-impedance copper for good thermal and current handling.
2 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
3 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
4 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
5 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
6 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
7 FB input Feedback input. For the fixed 5.0V version, wire directly to the regulated 5.0V output node. Internal reference is 1.23V; typical feedback bias current 50 nA (max 500 nA). Keep trace short to avoid noise pickup.
8 SIG_GND power_in Signal (analog) ground reference for the internal control circuitry. Tie together with power ground at a single quiet point close to the device to avoid switching-current-induced offsets.
9 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
10 ON/OFF input TTL/CMOS-compatible shutdown input. Ground (or hold below ~1.2V) for normal operation; drive above ~2.2V (up to +VIN) to place the regulator in standby (~50 µA typ). Do not leave floating.
11 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
12 PWR_GND power_in Power ground return for the internal power switch. Tie to pin 1 and to the input/output capacitor return using wide low-impedance copper.
13 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
14 VIN power_in Unregulated DC input supply. High-voltage version operates 8V to 60V (absolute max 63V). Tie to pin 15 and bypass with at least a 47 µF electrolytic capacitor placed close to the device.
15 VIN power_in Unregulated DC input supply (paralleled with pin 14). Both VIN pins must be connected to the same input bypass network.
16 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
17 OUTPUT output Emitter of the internal NPN power switch. Connects to the catch diode cathode and the inductor. Sourcing rating 1A (2.2A typ current limit); saturation voltage 0.9V typ at 1A. Tie to pin 18.
18 OUTPUT output Switch node (paralleled with pin 17). Both OUTPUT pins must be tied together and routed to the external Schottky catch diode and inductor with short, wide traces.
19 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
20 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
21 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
22 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
23 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.
24 NC unconnected No internal connection. Solder to PCB copper for improved thermal performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-24-300mil
Category Power Management (PMIC)
Pins 24

Ordering variants

Same part, different packaging or reel option.

  • LM2575HVMX-5.0/NOPB
  • LM2575HVM-5.0/NOPB
  • LM2575MX-5.0/NOPB
  • LM2575M-5.0/NOPB
  • LM2575T-5.0
  • LM2575HVT-5.0
  • LM2575S-5.0
  • LM2575HVS-5.0
  • LM2575N-5.0
  • LM2575HVN-5.0

The extractor listed these alongside LM2575HVMX-5.0, but they are different parts with different electrical characteristics. Do not order them as substitutes.

  • LM2575HVMX-5.0LM1575J-5.0-QML

CAD (KiCad official)

  • Symbol: LM2575HVMX-5.0
  • Footprint: Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm
  • 3D model: SOIC-24-300mil (KiCad packages3D, STEP)
  • 3D model files: lm2575hvmx-5-0-etched.step / lm2575hvmx-5-0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2575hvmx-5-0.step / lm2575hvmx-5-0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (None pp, sha256 67d18983ac3edb34, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF