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Initial commit: component/lm2575hvmx-5-0

Ray ·ef360c9344 ·1mo ago
2 files changed +114
README.mdadded+80
@@ -0,0 +1,80 @@+# LM2575HVMX-5.0++**Texas Instruments** · DC-DC Converters · SOIC-24-300mil++LM2575HVMX-5.0 from Texas Instruments, in a SOIC-24-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | PWR_GND | power_in | Power ground return for the internal power switch. Tie to pin 12 and to the input/output capacitor return; use wide, low-impedance copper for good thermal and current handling. |+| 2 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 3 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 4 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 5 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 6 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 7 | FB | input | Feedback input. For the fixed 5.0V version, wire directly to the regulated 5.0V output node. Internal reference is 1.23V; typical feedback bias current 50 nA (max 500 nA). Keep trace short to avoid noise pickup. |+| 8 | SIG_GND | power_in | Signal (analog) ground reference for the internal control circuitry. Tie together with power ground at a single quiet point close to the device to avoid switching-current-induced offsets. |+| 9 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 10 | ON/OFF | input | TTL/CMOS-compatible shutdown input. Ground (or hold below ~1.2V) for normal operation; drive above ~2.2V (up to +VIN) to place the regulator in standby (~50 µA typ). Do not leave floating. |+| 11 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 12 | PWR_GND | power_in | Power ground return for the internal power switch. Tie to pin 1 and to the input/output capacitor return using wide low-impedance copper. |+| 13 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 14 | VIN | power_in | Unregulated DC input supply. High-voltage version operates 8V to 60V (absolute max 63V). Tie to pin 15 and bypass with at least a 47 µF electrolytic capacitor placed close to the device. |+| 15 | VIN | power_in | Unregulated DC input supply (paralleled with pin 14). Both VIN pins must be connected to the same input bypass network. |+| 16 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 17 | OUTPUT | output | Emitter of the internal NPN power switch. Connects to the catch diode cathode and the inductor. Sourcing rating 1A (2.2A typ current limit); saturation voltage 0.9V typ at 1A. Tie to pin 18. |+| 18 | OUTPUT | output | Switch node (paralleled with pin 17). Both OUTPUT pins must be tied together and routed to the external Schottky catch diode and inductor with short, wide traces. |+| 19 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 20 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 21 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 22 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 23 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |+| 24 | NC | unconnected | No internal connection. Solder to PCB copper for improved thermal performance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | SOIC-24-300mil |+| Category | Power Management (PMIC) |+| Pins | 24 |++## Ordering variants++Same part, different packaging or reel option.++- `LM2575HVMX-5.0/NOPB`+- `LM2575HVM-5.0/NOPB`+- `LM2575MX-5.0/NOPB`+- `LM2575M-5.0/NOPB`+- `LM2575T-5.0`+- `LM2575HVT-5.0`+- `LM2575S-5.0`+- `LM2575HVS-5.0`+- `LM2575N-5.0`+- `LM2575HVN-5.0`++## Related parts (NOT interchangeable)++The extractor listed these alongside LM2575HVMX-5.0, but they are **different parts** with different electrical characteristics. Do not order them as substitutes.++- `LM2575HVMX-5.0LM1575J-5.0-QML`++## CAD (KiCad official)++- Symbol: `LM2575HVMX-5.0`+- Footprint: `Package_SO:SOIC-24W_7.5x15.4mm_P1.27mm`+- 3D model: SOIC-24-300mil (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm2575hv) (None pp, sha256 `67d18983ac3edb34`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/lm2575hvmx-5-0-datasheet.pdf)
page.jsonadded+34
@@ -0,0 +1,34 @@+{+  "slug": "lm2575hvmx-5-0",+  "version": "0.1.0",+  "type": "component",+  "description": "Texas Instruments DC-DC Converters, SOIC-24-300mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "power management (pmic)",+    "lm2575hvmx-5.0"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "lm2575hvmx-5-0.kicad_sym",+    "lm2575hvmx-5-0.kicad_mod",+    "lm2575hvmx-5-0.glb",+    "lm2575hvmx-5-0.step",+    "lm2575hvmx-5-0.lbr",+    "docs/hero.png",+    "docs/lm2575hvmx-5-0-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html"+  ],+  "visibility": "public",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file