component
LM2574M-ADJ
Public Made by Adomby adom
Texas Instruments DC-DC Converters, SOIC-14-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LM2574M-ADJ
Texas Instruments · DC-DC Converters · SOIC-14-300mil
LM2574M-ADJ from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 2 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 3 | FB | input | Feedback sense input pin; connect to midpoint of feedback divider to set VOUT for adjustable version or to output capacitor for fixed output version. |
| 4 | SIG_GND | power_in | Signal ground pin, ground reference for internal references and logic; connect to system ground. |
| 5 | ON/OFF | input | TTL compatible enable input (high = OFF, low = ON); do not leave this pin floating. |
| 6 | PWR_GND | power_in | Power ground pin; connect to system ground and ground pins of CIN and COUT with path to CIN as short as possible. |
| 7 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 8 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 9 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 10 | VIN | power_in | Supply input pin to collector of high-side transistor (maximum 45V for LM2574); connect to power supply and input bypass capacitors CIN. |
| 11 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 12 | OUTPUT | output | Emitter pin of power transistor, switching node; attach to inductor and cathode of external diode. |
| 13 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 14 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14-300mil |
| Category | Power Management (PMIC) |
| Pins | 14 |
CAD (KiCad official)
- Symbol:
LM2574M-ADJ - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
- 3D model files:
lm2574m-adj-etched.step/lm2574m-adj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm2574m-adj.step/lm2574m-adj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (42 pp, sha256
61a9f44cec6689e8, retrieved 2026-10-06, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).