# LM2574HVMX-15

**Texas Instruments** · DC-DC Converters · SOIC-14-300mil

LM2574HVMX-15 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 2 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 3 | FB | input | Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for ADJ version or connect this pin directly to the output capacitor for a fixed output version. |
| 4 | SIG_GND | power_in | Signal ground pin. Ground reference for internal references and logic. Connect to system ground. |
| 5 | ON/OFF | input | Enable input to the voltage regulator. High = OFF and low = ON. Connect to GND to enable the voltage regulator. Do not leave this pin float. |
| 6 | PWR_GND | power_in | Power ground pins. Connect to system ground and SIF GND, ground pins of CIN and COUT. Path to CIN must be as short as possible. |
| 7 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 8 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 9 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 10 | VIN | power_in | Supply input pin to collector pin of high-side transistor. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and PWR GND must be as short as possible. |
| 11 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 12 | OUTPUT | output | Emitter pin of the power transistor. This is a switching node. Attached this pin to an inductor and the cathode of the external diode. |
| 13 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |
| 14 | NC | unconnected | No internal connection, but must be soldered to PCB for best heat transfer. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14-300mil |
| Category | Power Supply Chip |
| Pins | 14 |

## CAD (KiCad official)

- Symbol: `LM2574HVMX-15`
- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`
- 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
- 3D model files: `lm2574hvmx-15-etched.step` / `lm2574hvmx-15-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm2574hvmx-15.step` / `lm2574hvmx-15.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm2574) (42 pp, sha256 `61a9f44cec6689e8`, retrieved 2026-10-03, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm2574hvmx-15-datasheet.pdf)