component
LM2574HVM-3.3
Public Made by Adomby adom
Texas Instruments DC-DC Converters, SOIC-14-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LM2574HVM-3.3
Texas Instruments · DC-DC Converters · SOIC-14-300mil
LM2574HVM-3.3 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 2 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 3 | FB | input | Feedback sense input: connect to the midpoint of the feedback divider to set VOUT on the ADJ version, or connect directly to the output capacitor on a fixed-output version such as the 3.3 V part. |
| 4 | SIG_GND | power_in | Signal ground reference for the internal references and logic; connect to system ground. |
| 5 | ON/OFF | input | Enable input: high = OFF and low = ON, so connect to GND to enable the regulator; do not leave this pin floating. The datasheet specifies an ON/OFF input voltage of -0.3 V to VIN. |
| 6 | PWR_GND | power_in | Power ground; connect to system ground and to the ground pins of CIN and COUT, keeping the path to CIN as short as possible. |
| 7 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 8 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 9 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 10 | VIN | power_in | Supply input to the collector of the high-side transistor; connect to the supply and the input bypass capacitor CIN with a short path to PWR_GND. Recommended supply for the HV version is up to 60 V, with an absolute maximum of 63 V. |
| 11 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 12 | OUTPUT | output | Emitter of the power transistor and the switching node; connect to the inductor and the cathode of the external catch diode. Steady-state voltage to ground is rated at -1 V minimum. |
| 13 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 14 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14-300mil |
| Category | Power Management (PMIC) |
| Pins | 14 |
CAD (KiCad official)
- Symbol:
LM2574HVM-3.3 - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
- 3D model files:
lm2574hvm-3-3-etched.step/lm2574hvm-3-3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm2574hvm-3-3.step/lm2574hvm-3-3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (42 pp, sha256
61a9f44cec6689e8, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LM2574HVM-3.3
**Texas Instruments** · DC-DC Converters · SOIC-14-300mil
LM2574HVM-3.3 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 2 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 3 | FB | input | Feedback sense input: connect to the midpoint of the feedback divider to set VOUT on the ADJ version, or connect directly to the output capacitor on a fixed-output version such as the 3.3 V part. |
| 4 | SIG_GND | power_in | Signal ground reference for the internal references and logic; connect to system ground. |
| 5 | ON/OFF | input | Enable input: high = OFF and low = ON, so connect to GND to enable the regulator; do not leave this pin floating. The datasheet specifies an ON/OFF input voltage of -0.3 V to VIN. |
| 6 | PWR_GND | power_in | Power ground; connect to system ground and to the ground pins of CIN and COUT, keeping the path to CIN as short as possible. |
| 7 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 8 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 9 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 10 | VIN | power_in | Supply input to the collector of the high-side transistor; connect to the supply and the input bypass capacitor CIN with a short path to PWR_GND. Recommended supply for the HV version is up to 60 V, with an absolute maximum of 63 V. |
| 11 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 12 | OUTPUT | output | Emitter of the power transistor and the switching node; connect to the inductor and the cathode of the external catch diode. Steady-state voltage to ground is rated at -1 V minimum. |
| 13 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
| 14 | NC | unconnected | No internal connection, but must be soldered to the PCB for best heat transfer. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14-300mil |
| Category | Power Management (PMIC) |
| Pins | 14 |
## CAD (KiCad official)
- Symbol: `LM2574HVM-3.3`
- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`
- 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
- 3D model files: `lm2574hvm-3-3-etched.step` / `lm2574hvm-3-3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm2574hvm-3-3.step` / `lm2574hvm-3-3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm2574) (42 pp, sha256 `61a9f44cec6689e8`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lm2574hvm-3-3-datasheet.pdf)