LM25085MY from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	ADJ	input	Current limit adjust pin: the current limit threshold is set by an external resistor from VIN to ADJ together with the external sense resistor or the PFET RDS(ON), and CADJ filters noise from this pin.
2	RT	input	On-time control and shutdown pin: an external resistor from VIN to RT sets the buck switch on-time and switching frequency, and grounding this pin shuts down the controller.
3	FB	input	Voltage feedback from the regulated output, input to the regulation and over-voltage comparators, with a regulation level of 1.25V.
4	GND	power_in	Circuit ground, the ground reference for all internal circuitry.
5	ISEN	input	Current sense input for current limit detection: connect to the PFET drain when using RDS(ON) sensing, or to the PFET source and the sense resistor when using a sense resistor.
6	PGATE	output	Gate driver output that connects to the gate of the external PFET, swinging between VIN (Q1 off) and the VCC pin voltage (Q1 on).
7	VCC	power_out	Output of the gate driver bias regulator, a negative voltage relative to VIN, which requires a low ESR capacitor from VIN to VCC placed as close as possible to the pins.
8	VIN	power_in	Input supply voltage with an operating input range of 4.5V to 42V, which requires a low ESR bypass capacitor located as close as possible to the VIN and GND pins.
9	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	MSOP-8-EP
Category	Power Management (PMIC)
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VIN to GND		-0.3		45	V		4
ISEN to GND		-3			V	max is VIN + 0.3 V	4
ADJ to GND		-0.3			V	max is VIN + 0.3 V	4
RT, FB to GND		-0.3		7	V		4
VIN to VCC, VIN to PGATE		-0.3		10	V		4
Storage temperature range	Tstg	-65		150	°C		4
VIN Voltage	VIN	4.5		42	V	Over operating free-air temperature range	4
Junction Temperature		-40		125	°C	Over operating free-air temperature range	4
IIN Operating Current	IIN		1.25	1.75	mA	Non-Switching, FB = 1.4V	5
IQ Shutdown Current	IQ		175	300	µA	RT = 0V	5
VCC Regulator VIN - VCC	VCC(reg)	6.9	7.7	8.5	V	Vin = 9V, FB = 1.4V, ICC = 0mA	5
VCC Regulator VIN - VCC at ICC 20mA	VCC(reg)		7.7		V	Vin = 9V, FB = 1.4V, ICC = 20mA	5
VCC Regulator VIN - VCC at Vin 42V	VCC(reg)		7.7		V	Vin = 42V, FB = 1.4V, ICC = 0mA	5
VCC Under-Voltage Lock-Out Threshold	UVLOVcc		3.8		V	VCC Increasing	5
VCC Under-Voltage Lock-Out Hysteresis	UVLOVcc		260		mV	VCC Decreasing	5
VCC Current Limit	VCC(CL)		20	40	mA	FB = 1.4V	5
Driver Output Source Current	IPGATE	1.75			A	VIN = 12V, PGATE = VIN - 3.5V	5
Driver Output Sink Current	IPGATE	1.5			A	VIN = 12V, PGATE = VIN - 3.5V	5
Driver Output Resistance (source)	RPGATE		2.3		Ω	Source current = 500mA	5
Driver Output Resistance (sink)	RPGATE		2.3		Ω	Sink current = 500mA	5
ADJUST Pin Current Source	IADJ	32	40	48	µA	VADJ = 22.5V	5
Current Limit Comparator Offset	VCL OFFSET	-9	0	9	mV	VADJ = 22.5V, VADJ - VISEN	5
Shutdown Threshold	RTSD		0.73		V	RT Pin Voltage Rising	5
Shutdown Threshold Hysteresis	RTHYS		50		mV		5
On-Time 1	tON, 1	3.5	5	7.15	µs	VIN = 4.5V, RT = 100kΩ	5
On-Time 2	tON, 2	560	720	870	ns	VIN = 24V, RT = 100kΩ	5
On-Time 3	tON - 3	329	415	500	ns	VIN = 42V, RT = 100kΩ	5
Minimum On-Time in Current Limit	tON - 4	55	140	235	ns	VIN = 24V, 25mV Overdrive at ISEN	5
Off-Time (Current Limit) 1	tOFF(CL1)	5.35	7.9	10.84	µs	VIN = 12V, VFB = 0V	5
Off-Time (Current Limit) 2	tOFF(CL2)	1.42	1.9	3.03	µs	VIN = 12V, VFB = 1V	5
Off-Time (Current Limit) 3	tOFF(CL3)	8.9	13	17.7	µs	VIN = 24V, VFB = 0V	5
Off-Time (Current Limit) 4	tOFF(CL4)	2.22	3.2	4.68	µs	VIN = 24V, VFB = 1V	5
FB Regulation Threshold	VREF	1.225	1.25	1.275	V		5
Soft-Start Time	tSS	1.4	2.5	4.3	ms		6
FB Over-Voltage Threshold	VOV		350		mV	Measured With Respect to VREF	5
FB Bias Current	IFB		10		nA		5
Junction Shutdown Temperature	TSD		170		°C	Junction Temperature Rising	6
Junction Shutdown Hysteresis	THYS		20		°C		6
Junction-to-ambient thermal resistance (HVSSOP-PowerPAD)	RθJA		54.1		°C/W		4
Junction-to-case (top) thermal resistance (HVSSOP-PowerPAD)	RθJC		49.1		°C/W		4
Junction-to-board thermal resistance (HVSSOP-PowerPAD)	RθJB		26.7		°C/W		4
Junction-to-top characterization parameter (HVSSOP-PowerPAD)	ψJT		1.3		°C/W		4
Junction-to-board characterization parameter (HVSSOP-PowerPAD)	ψJB		26.5		°C/W		4
Junction-to-case (bottom) thermal resistance (HVSSOP-PowerPAD)	RθJC(bot)		3.6		°C/W		4

CAD (KiCad official)

Symbol: LM25085MY
Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
3D model: MSOP-8-EP (KiCad packages3D, STEP)
3D model files: lm25085my-etched.step / lm25085my-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm25085my.step / lm25085my.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (40 pp, sha256 255a8aef9377a78d, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

LM25085MY

Verified LM25085MY

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

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