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Contents

README

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LM25011AMY

Texas Instruments · DC-DC Converters · HVSSOP-10

LM25011AMY from Texas Instruments, in a HVSSOP-10. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply voltage with an operating range of 6 V to 42 V and a 45 V transient capability; a low-ESR capacitor must be placed as close as possible to the VIN and SGND pins.
2 RT input On-time control: an external resistor from VIN to this pin sets the buck switch on-time and the switching frequency.
3 PGD output Power-good logic output that indicates when the FB voltage has risen above 95% of the internal reference, with hysteresis; an external pull-up resistor to a voltage less than 7 V is required.
4 SS input Soft-start pin: an internal current source charges an external capacitor to provide the soft-start function.
5 SGND power_in Signal ground for all internal circuitry other than the current limit sense circuit.
6 FB input Feedback input connected internally to the regulation comparator, with a regulation level of 2.51 V.
7 CSG power_in Current sense ground: connect to ground and to the current sense resistor for the current limit sensing circuit.
8 CS input Current sense input: connect to the current sense resistor and the anode of the free-wheeling diode.
9 SW output Switching node connected internally to the buck switch source; connect to the external inductor, the cathode of the free-wheeling diode, and the bootstrap capacitor.
10 BST input Bootstrap capacitor connection for the buck switch gate driver; connect a 0.1 µF capacitor from SW to this pin, charged during the buck switch off-time via an internal diode.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-10
Category Power Management (PMIC)
Pins 11

CAD (KiCad official)

  • Symbol: LM25011AMY
  • Footprint: Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.83x1.89mm
  • 3D model: HVSSOP-10, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lm25011amy-etched.step / lm25011amy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm25011amy.step / lm25011amy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 cb448b6c7c95f313, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF