# LM236M-2.5

**HGSEMI** · Voltage Reference · SOP-8

LM236M-2.5 from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection pin on the SOP-8 package. |
| 2 | NC | unconnected | No connection pin on the SOP-8 package. |
| 3 | NC | unconnected | No connection pin on the SOP-8 package. |
| 4 | V- | power_in | Negative terminal (anode) of the 2.5V reference diode, used as ground; reverse current rated 400µA to 10mA operating, 15mA max. |
| 5 | ADJ | passive | Adjustment pin for trimming the reference breakdown voltage and temperature coefficient, e.g. with a 10kΩ potentiometer. |
| 6 | NC | unconnected | No connection pin on the SOP-8 package. |
| 7 | NC | unconnected | No connection pin on the SOP-8 package. |
| 8 | V+ | power_in | Positive terminal (cathode) of the 2.5V reference diode, typical 2.49V breakdown at 1mA, 400µA to 10mA operating current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VR | 2.44 | 2.49 | 2.54 | V | Tamb = +25°C, IR = 1mA | 3 |
| Reverse Breakdown Voltage Change with Current, Tamb = +25°C | VR |  | 3 | 10 | mV | 400µA ≤ IR ≤ 10mA, Tamb = +25°C | 3 |
| Reverse Breakdown Voltage Change with Current, Tmin to Tmax | VR |  | 2.6 | 12 | mV | 400µA ≤ IR ≤ 10mA, Tmin ≤ Tamb ≤ Tmax | 3 |
| Reverse Dynamic Impedance, Tamb = +25°C | ZD |  | 0.2 | 0.4 | Ω | IR = 1mA, Tamb = +25°C | 3 |
| Reverse Dynamic Impedance, Tmin to Tmax | ZD |  | 1 | 1.4 | Ω | IR = 1mA, Tmin ≤ Tamb ≤ Tmax | 3 |
| Temperature Stability | KVT |  | 1.8 | 6 | mV | VR = 2.49V, IR = 1mA | 3 |
| Reverse Current | IRIF |  |  | 15 | mA |  | 3 |
| Forward Current | IRIF |  |  | 10 | mA |  | 3 |
| Operating Free-air Temperature Range (LM236-2.5) | Toper | -40 |  | 85 | °C | LM236-2.5 | 3 |
| Storage Temperature Range | TStg | -65 |  | 150 | °C |  | 3 |
| Lead Temperature (Soldering) | TL |  |  | 260 | °C | 10 seconds | 3 |

## CAD (KiCad official)

- Symbol: `LM236M-2.5`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `lm236m-2-5-etched.step` / `lm236m-2-5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm236m-2-5.step` / `lm236m-2-5.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757211567546863616) (12 pp, sha256 `55ebb8983fca01ec`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm236m-2-5-datasheet.pdf)