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Ray Publish 0.1.0 7d31869 17d ago

LM236D-2.5RG

HANSCHIP semiconductor · Voltage Reference · SOP-8

LM236D-2.5RG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect pin; the datasheet gives no electrical function or limits for it.
2 NC unconnected No connect pin; the datasheet gives no electrical function or limits for it.
3 NC unconnected No connect pin; the datasheet gives no electrical function or limits for it.
4 V- power_in Negative (anode) terminal of the 2.5V shunt reference, used as ground reference; forward current is limited to 10 mA maximum.
5 ADJ passive Adjustment pin for trimming the reference breakdown voltage and temperature coefficient, typically via a 10kΩ potentiometer.
6 NC unconnected No connect pin; the datasheet gives no electrical function or limits for it.
7 NC unconnected No connect pin; the datasheet gives no electrical function or limits for it.
8 V+ power_in Positive (cathode) terminal of the 2.5V shunt reference, operating at 400µA to 10 mA reverse current with 15 mA maximum reverse current.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reference breakdown voltage VR 2.44 2.49 2.54 V Tamb = +25°C, IR = 1mA 3
Reverse breakdown voltage change with current (Tamb = +25°C) VR 2.6 3 mV 400µA ≤ IR ≤ 10mA, Tamb = +25°C 3
Reverse breakdown voltage change with current (Tmin ≤ Tamb ≤ Tmax) VR 10 12 mV 400µA ≤ IR ≤ 10mA, Tmin ≤ Tamb ≤ Tmax 3
Reverse dynamic impedance (Tamb = +25°C) ZD 0.2 0.4 Ω IR = 1mA, Tamb = +25°C 3
Reverse dynamic impedance (Tmin ≤ Tamb ≤ Tmax) ZD 1 1.4 Ω IR = 1mA, Tmin ≤ Tamb ≤ Tmax 3
Temperature stability KVT 1.8 6 mV VR = 2.49V, IR = 1mA 3
Reverse current IRIF 15 mA Reverse 3
Forward current IRIF 10 mA Forward 3
Operating free-air temperature range (LM236-2.5) Toper -40 85 °C LM236-2.5 3
Storage temperature range TStg -65 150 °C 3
Lead temperature (soldering, 10 seconds) TL 245 °C Soldering, 10 seconds 3

CAD (KiCad official)

  • Symbol: LM236D-2.5RG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: lm236d-2-5rg-etched.step / lm236d-2-5rg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm236d-2-5rg.step / lm236d-2-5rg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (12 pp, sha256 0c924d8c297c794e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF