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LM1117MPX-18NOPB

onsemi · Linear Voltage Regulators (LDO) · SOT-223

LM1117MPX-18NOPB from onsemi, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Adjust/Ground power_in Pin 1 is the ground return for the fixed 1.8 V output; on adjustable devices it is the adjust pin, where Iadj is typically 52 µA and at most 120 µA (Vin = 11.25 V, Iout = 800 mA).
2 Output power_out Regulated output, with output current limit of 1000 mA min, 1500 mA typ and 2200 mA max, and the device must not exceed 1.0 A when Vin is greater than 12 V; the heatsink tab is connected to this pin.
3 Input power_in Unregulated input supply, with an absolute maximum input voltage of 20 V and a dropout of 1.2 V maximum at 800 mA (Vin − Vout).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-223
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage, Fixed Output Devices, 1.8 V Vout 1.782 1.8 1.818 V Vin = 3.8 V, Iout = 10 mA, TA = 25 °C 3
Output Voltage, Fixed Output Devices, 1.8 V Vout 1.755 1.845 V Vin = 3.2 V to 11.8 V, Iout = 0 mA to 800 mA (Note 4) 3
Dropout Voltage Vin−Vout 0.95 1.1 V Measured at Vout − 100 mV, Iout = 100 mA 3
Dropout Voltage Vin−Vout 1.01 1.15 V Measured at Vout − 100 mV, Iout = 500 mA 3
Dropout Voltage Vin−Vout 1.07 1.2 V Measured at Vout − 100 mV, Iout = 800 mA 3
Output Current Limit Iout 1000 1500 2200 mA Vin−Vout = 5.0 V, TA = 25°C, Note 6 3
Line Regulation, 1.8 V Regline 0.4 1 mV Vin = 3.2 V to 11.8 V, Iout = 0 mA (Note 5) 3
Load Regulation, 1.8 V Regline 2.6 6 mV Iout = 0 mA to 800 mA, Vin = 3.2 V (Note 5) 3
Quiescent Current, 1.8 V IQ 4.2 10 mA Vin = 11.8 V 3
Thermal Regulation 0.01 0.1 %/W TA = 25°C, 30 ms Pulse 3
Ripple Rejection, 1.8 V RR 66 70 dB Vin−Vout = 6.4 V, Iout = 500 mA, 10 Vpp 120 Hz Sinewave 3
Input Voltage Vin 20 V Note 1 2
Maximum Die Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range Tstg -65 150 °C 2
Operating Ambient Temperature Range (LM1117) TA 0 125 °C LM1117 grade (not LM1117I) 2
Thermal Resistance, Junction-to-Ambient, Minimum Size Pad RJA 160 °C/W Minimum size pad 2
Thermal Resistance, Junction-to-Case RJC 15 °C/W 2

CAD (KiCad official)

  • Symbol: LM1117MPX-18NOPB
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: lm1117mpx-18nopb-etched.step / lm1117mpx-18nopb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm1117mpx-18nopb.step / lm1117mpx-18nopb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 d4a212fd6b43e65e, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF