component
LM10011SD
Public Made by Adomby adom
Texas Instruments Power Management Specialized - PMIC, WSON-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 6h ago |
| viewers | 6h ago |
| lm10011sd-etched.glb | 6h ago |
| lm10011sd-etched.step | 6h ago |
| lm10011sd-hero.glb | 6h ago |
| lm10011sd-hero.overlay.json | 6h ago |
| lm10011sd.glb | 6h ago |
| lm10011sd.kicad_mod | 6h ago |
| lm10011sd.kicad_sym | 6h ago |
| lm10011sd.lbr | 6h ago |
| lm10011sd.step | 6h ago |
| package.json | 6h ago |
| page.json | 6h ago |
| README.md | 6h ago |
LM10011SD
Texas Instruments · Power Management Specialized - PMIC · WSON-10-EP(3x3)
LM10011SD from Texas Instruments, in a WSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground. |
| 2 | IDAC_OUT | output | Output pin of the current DAC that connects to the feedback node of the regulator (0 to 59.2 µA full-scale range). |
| 3 | VDD | power_in | Positive supply input with operating voltage of 2.97 V to 5.5 V; a 1-nF or greater bypass capacitor to GND is recommended. |
| 4 | EN | input | Precision enable input; the device operates when the EN pin voltage exceeds 1.34 V. |
| 5 | MODE | input | Sets the VID operating mode: connect to VDD for the 4-bit parallel interface or to GND for the 4-pin, 6-bit interface. |
| 6 | SET | passive | A resistor from SET to GND sets the start-up code (current) at IDAC_OUT, with 16 start-up codes to select from. |
| 7 | VIDA | input | VID digital input: in 6-bit mode Bit 0 when VIDS transitions low and Bit 3 when VIDS transitions high; in 4-bit mode Bit 0. |
| 8 | VIDB | input | VID digital input: in 6-bit mode Bit 1 when VIDS transitions low and Bit 4 when VIDS transitions high; in 4-bit mode Bit 1. |
| 9 | VIDC | input | VID digital input: in 6-bit mode Bit 2 when VIDS transitions low and Bit 5 when VIDS transitions high; in 4-bit mode Bit 2. |
| 10 | VIDS | input | VID select line: in 6-bit mode a low transition selects the lower 3 bits and a high transition selects the upper 3 bits and updates the IDAC_OUT current; in 4-bit mode Bit 3. |
| 11 | DAP | passive | Die Attach Pad, not electrically connected to the device; connect to the system ground plane for reduced thermal resistance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-10-EP(3x3) |
| Category | Power Supply Chip |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Quiescent current | IQ | 260 | 300 | µA | VDD = 5.0 V, VEN = 2.0 V | 5 | |
| Quiescent current, IDAC_OUT = IFS_6 | IQ_FS | 382 | µA | VDD = 5.0 V, VEN = 2.0 V, IFS_6 | 5 | ||
| Quiescent current disabled | IQ_DIS | 45 | 65 | µA | VDD = 5.0 V, VEN = 0.0 V | 5 | |
| Undervoltage rising threshold | VUVLO_R | 2.65 | 2.95 | V | VDD rising | 5 | |
| Undervoltage falling threshold | VUVLO_F | 2.2 | 2.45 | V | VDD falling | 5 | |
| UVLO hysteresis | VUVLO_HYS | 200 | mV | 5 | |||
| Enable rising threshold | VEN | 1.2 | 1.34 | 1.45 | V | VEN rising | 5 |
| Enable hysteresis | VEN_HYS | 50 | 100 | 180 | mV | 5 | |
| Enable pullup current | IEN | 2 | µA | 5 | |||
| IDAC_OUT accuracy | ACC | -1.25 | 1.25 | % | Measured at full scale | 5 | |
| IDAC_OUT accuracy | ACC | -1 | 1 | % | Measured at full scale, 0°C to 100°C | 5 | |
| Integral non-linearity | INL | -1 | 1 | LSB_6 | 5 | ||
| Differential non-linearity | DNL | -0.25 | 0.25 | LSB_6 | 5 | ||
| DAC step size, 6-bit mode | LSB_6 | 940 | nA | IFS_6 / (2^6, 1) | 5 | ||
| DAC step size, 4-bit mode | LSB_4 | 3.76 | µA | IFS_4 / (2^4, 1) | 5 | ||
| Full-scale output current (6-bit mode) | IFS_6 | 59.2 | µA | VID[5:0] = 000000b | 5 | ||
| Full-scale output current (4-bit mode) | IFS_4 | 56.4 | µA | VID[3:0] = 0000b | 5 | ||
| Offset current | OFFSET | 60 | nA | VID[5:0] = 111111b (6-bit), VID[3:0] = 1111b (4-bit) | 5 | ||
| IDAC_OUT compliance voltage | VOUT_MAX | 1.75 | V | VDD = 3 V, VDD-VIDAC_OUT | 5 | ||
| SET pin voltage FSR | VSETFSR | 1.12 | 1.2 | 1.23 | V | 5 | |
| SET ADC resolution | SETRES | 4 | bits | 5 | |||
| SET ADC current full-scale range | SETRNG | 56.4 | µA | 5 | |||
| SET current | ISET | 4.75 | 5.1 | 5.4 | µA | 5 | |
| Start-up DAC error, codes 4-14 | SET4-SET14 | 0 | 1 | LSB | RSET per code, 1% E96 | 5 | |
| Input voltage low | VIL | 0.75 | V | 6 | |||
| Input voltage high | VIH | 1 | V | 6 | |||
| Input current low | IIL | -3.5 | µA | 6 | |||
| Input current high | IIH | 5 | µA | 6 | |||
| Input deglitch time | tDEGLITCH | 3.6 | µs | 6 | |||
| Delay to beginning of IDAC_OUT transition | t5 | 6.3 | 10 | µs | Measured from VIDS rising edge | 6 | |
| IDAC_OUT transition time | t6 | 40 | µs | Time constant for exponential rise | 6 | ||
| Minimum hold time in 4-bit mode | t7 | 4.4 | µs | VIDA, VIDB, VIDC, VIDS | 6 | ||
| Supply voltage VDD | VDD | 2.97 | 5.5 | V | 4 | ||
| IDAC_OUT voltage | IDAC_OUT | -0.3 | V | max is VDD, 1.75 V | 4 | ||
| VID, EN, MODE input voltage | -0.3 | 5.5 | V | VIDA, VIDB, VIDC, VIDS, EN, MODE | 4 | ||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Ambient temperature | TA | -40 | 125 | °C | 4 | ||
| VDD, EN, IDAC_OUT, MODE voltage | -0.3 | 6 | V | 3 | |||
| VIDA, VIDB, VIDC, VIDS voltage | -0.3 | 6 | V | 3 | |||
| Junction temperature | TJ | 150 | °C | 3 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | 2 | kV | Human body model, all pins | 4 | ||
| ESD CDM | V(ESD) | 1 | kV | Charged device model, all pins | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 52.1 | °C/W | DSC, 10 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 30.6 | °C/W | DSC, 10 pins | 4 | ||
| Junction-to-board thermal resistance | RθJB | 26.8 | °C/W | DSC, 10 pins | 4 | ||
| Junction-to-top characterization parameter | ψJT | 0.9 | °C/W | DSC, 10 pins | 4 | ||
| Junction-to-board characterization parameter | ψJB | 26.9 | °C/W | DSC, 10 pins | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 7.7 | °C/W | DSC, 10 pins | 4 |
CAD (KiCad official)
- Symbol:
LM10011SD - Footprint:
Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm - 3D model: WSON-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
lm10011sd-etched.step/lm10011sd-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm10011sd.step/lm10011sd.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (24 pp, sha256
b82d7be86f059974, retrieved 2026-10-22, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).