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LIS2DUX12TR

Public Made by Adom

by adom

STMicroelectronics Accelerometers, LGA-12(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LIS2DUX12TR

STMicroelectronics · Accelerometers · LGA-12(2x2)

LIS2DUX12TR from STMicroelectronics, in a LGA-12(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SCL/SPC input I²C/MIPI I3C serial clock (SCL) in I²C/I3C mode and SPI serial port clock (SPC) in SPI mode; default is an input without internal pull-up.
2 CS input Mode select: 1 selects SPI idle mode with I²C/MIPI I3C enabled, 0 selects SPI with I²C/MIPI I3C disabled; CS is internally pulled up by default and the pull-up can be disabled via CS_PU_DIS in PIN_CTRL (0Ch), and it must be tied high to Vdd_IO when using I²C.
3 SDO/SA0 bidirectional Serial data output (SDO) in SPI mode and I²C least significant address bit (SA0) selecting the device address; the internal pull-up is disconnected by default and can be enabled via SDO_PU_EN in PIN_CTRL (0Ch).
4 SDA/SDI/SDO bidirectional I²C/MIPI I3C serial data (SDA), SPI serial data input (SDI), or 3-wire interface serial data output (SDO); the internal pull-up is disconnected by default and can be enabled via SDA_PU_EN in PIN_CTRL (0Ch), and I²C lines must be pulled up to Vdd_IO through an external resistor.
5 NC unconnected Internally not connected; can be tied to Vdd, Vdd_IO, or GND.
6 GND power_in 0 V supply.
7 RES/EXT_CLK bidirectional Connect to GND if not used as interrupt pin 1; when INT1_ON_RES in CTRL1 (10h) is set to 1 the INT1 signals are routed to this pin, and when EXT_CLK_EN in EXT_CLK_CFG (08h) is set to 1 with INT1_ON_RES set to 0 it acts as the external clock input for synchronizing multiple sensors.
8 GND power_in 0 V supply.
9 Vdd power_in Core power supply, operating range 1.62 V to 3.6 V; decoupling capacitors (100 nF ceramic and 10 µF aluminum) should be placed as near as possible to this pin.
10 Vdd_IO power_in Power supply for I/O pins, 1.62 V to 3.6 V for I²C and SPI (extended range 1.08 V to 3.6 V for MIPI I3C); Vdd may be removed while Vdd_IO is maintained without blocking the bus.
11 INT2 bidirectional Interrupt pin 2, which also serves as clock input when selected in one-shot mode; default is input with internal pull-down that can be disabled via PD_DIS_INT2 in PIN_CTRL (0Ch), and the pin becomes push-pull output forced to GND once an interrupt is configured.
12 INT1 bidirectional Interrupt pin 1; default is input with internal pull-down that can be disabled via PD_DIS_INT1 in PIN_CTRL (0Ch), and the pin becomes push-pull output forced to GND once an interrupt is configured.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package LGA-12(2x2)
Category Sensors
Pins 12

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage Vdd 1.62 1.8 3.6 V 7
I/O pins supply voltage Vdd_IO 1.62 3.6 V I²C and SPI interfaces 7
I/O pins supply voltage Vdd_IO 1.08 3.6 V MIPI I3C interface 7
Digital high-level input voltage VIH 0.7 V Printed as 0.7*Vdd_IO 7
Digital low-level input voltage VIL 0.3 V Printed as 0.3*Vdd_IO 7
Digital high-level output voltage VOH 0.2 V IOH = 4 mA; printed as Vdd_IO - 0.2 7
Digital low-level output voltage VOL 0.2 V IOL = 4 mA 7
Zero-g level offset accuracy TyOff -30 30 mg 6
Zero-g offset change vs. temperature TCO -1 1 mg/°C 6
Sensitivity change vs. temperature TCS -0.035 0.035 %/°C 6
Self-test positive difference ST 50 700 mg X-axis 6
Self-test positive difference ST 200 1200 mg Z-axis 6
Operating temperature range Top -40 85 °C 7
Temperature offset Toff -15 15 °C 7
Supply voltage Vdd -0.3 4.3 V 11
I/O pins supply voltage Vdd_IO -0.3 4.3 V 11
Input voltage on any control pin Vin -0.3 V Upper limit printed as Vdd_IO + 0.3; pins CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0 11
Acceleration (any axis, unpowered) AUNP 3000 g for 0.5 ms 11
Acceleration (any axis, unpowered) AUNP 10000 g for 0.2 ms 11
Operating temperature range TOP -40 85 °C 11
Storage temperature range TSTG -40 125 °C 11
Electrostatic discharge protection ESD 2 kV HBM 11
SPI clock frequency fc(SPC) 10 MHz SPI, 4-wire and 3-wire 8
SPI clock period tc(SPC) 100 ns 8
SPI clock high thigh(SPC) 45 ns 8
SPI clock low tlow(SPC) 45 ns 8
CS setup time (mode 3) tsu(CS) 5 ns Mode 3 8
CS setup time (mode 0) tsu(CS) 20 ns Mode 0 8
CS hold time (mode 3) th(CS) 20 ns Mode 3 8
CS hold time (mode 0) th(CS) 20 ns Mode 0 8
SDI input setup time tsu(SI) 7 ns 8
SDI input hold time th(SI) 15 ns 8
SDO valid output time tv(SO) 15 25 ns 8
SDO output disable time tdis(SO) 50 ns 8
Bus capacitance Cload 100 pF 8
SCL clock frequency f(SCL) 0 400 kHz I²C fast mode 10
SCL clock frequency f(SCL) 0 1000 kHz I²C fast mode plus 10
SCL clock low time tw(SCLL) 1.3 µs I²C fast mode 10
SCL clock low time tw(SCLL) 0.5 µs I²C fast mode plus 10
SCL clock high time tw(SCLH) 0.6 µs I²C fast mode 10
SCL clock high time tw(SCLH) 0.285 µs I²C fast mode plus 10
SDA setup time tsu(SDA) 100 ns I²C fast mode 10
SDA setup time tsu(SDA) 50 ns I²C fast mode plus 10
START/REPEATED START condition hold time th(ST) 0.6 µs I²C fast mode 10
START/REPEATED START condition hold time th(ST) 0.26 µs I²C fast mode plus 10
Bus free time between STOP and START condition tw(SP:SR) 1.3 µs I²C fast mode 10
Bus free time between STOP and START condition tw(SP:SR) 0.5 µs I²C fast mode plus 10
Sensitivity So 0.061 mg/digit FS = ±2 g 6
Sensitivity So 0.122 mg/digit FS = ±4 g 6
Sensitivity So 0.244 mg/digit FS = ±8 g 6
Sensitivity So 0.488 mg/digit FS = ±16 g 6
Noise density - high-performance mode An 220 µg/√Hz FS = ±8 g; ODR = 800 Hz, BW = ODR/2 6
Supply current in high-performance mode IddHP 10.8 µA FS = ±8 g; ODR = all ODRs; BW = ODR/2 with antialiasing filter; temperature sensor off 7
Supply current in low-power mode IddLP 6.2 µA FS = ±8 g; ODR = 50 Hz, BW = ODR/2 with antialiasing filter; temperature sensor off 7
Supply current in ultralow-power mode IddULP 2.7 µA FS = ±8 g; ODR = 1.6 Hz, BW = ODR/2; temperature sensor off 7
Supply current in deep power-down IddPD 10 nA 7
Temperature sensor output change vs. temperature TSDr 0.045 °C/LSB 12-bit resolution 7

CAD (KiCad official)

  • Symbol: LIS2DUX12TR
  • Footprint: Package_LGA:LGA-12_2x2mm_P0.5mm
  • 3D model: LGA-12(2x2) (KiCad packages3D, STEP)
  • 3D model files: lis2dux12tr-etched.step / lis2dux12tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lis2dux12tr.step / lis2dux12tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (105 pp, sha256 65156f7ab1412992, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF